Chip Industry Week in Review
AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.
Three-Way Race To 3D-ICs
Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.
Chip Industry Week in Review
China's 3nm chip; state of the industry supply chain; imec's next big push; hyper-dimensional AI chip; OpenAI's $6.5B startup deal; Siemens buys Excellicon; chip revenue challenges; France's new OSAT.
Chip Industry Week in Review
Intel's new roadmap; EU chip plan needs work; RISC-V boost; UK IC workforce study; materials and wafer shipments; on-chip PDN sensor; IoT Wi-Fi 7; new e-beam lithography facility; more earning reports; Apple's 19B chips in U.S.
Radiation, Temperature, Power Challenges For Chips In Space
Semiconductors designed for spacecraft face a range of extreme conditions that impact aging. A reliable source of power is also needed.
Signal Integrity Plays Increasingly Critical Role In Chiplet Design
Chiplet design engineers have complex new considerations compared to PCB concepts.
3D-IC For The Masses
Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, but can it expand beyond that?
Chiplets Add New Power Issues
Well-understood challenges become much more complicated when SoCs are disaggregated.
Chiplet Tradeoffs And Limitations
Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on power, performance, and cost.
Chiplets: Where Are We Today?
The use of chiplet-based designs is expected to expand beyond high-performance parts to the broader market.
Implementing AI Activation Functions
Why flexibility, area, and performance are traded off in AI inferencing designs.
What Exactly Is Multi-Physics?
The chip industry's new buzzword comes with lots of implications and some vague definitions.
New Data Center Protocols Tackle AI
UALink scales up, while Ultra Ethernet scales out.
