Chip Industry Week In Review


Siemens announced plans to acquire Altair Engineering, a provider of industrial simulation and analysis, data science, and high-performance computing (HPC) software, for about $10 billion. Altair's software will become part of Siemens' Xcelerator portfolio and provide a boost to physics-based digital twins. Onto Innovation bought Lumina Instruments, a San Jose, California-based maker of lase... » read more

Chip Industry Week In Review


Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor's planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). President Biden signed into law a bill that exempts some semiconductor projects funded by the U.S.... » read more

Chip Industry Week In Review


Concerns mount on the use of American-manufactured semiconductors in Russian weapons, with Analog Devices, AMD, Intel and TI set to testify next week before the U.S. Senate Permanent Subcommittee on Investigations. Also, U.S. and other government agencies issued a joint advisory and more details about ongoing Russian military cyberattacks, espionage, and sabotage. The U.S. Commerce Departmen... » read more

Chip Industry Week In Review


Chinese firms imported almost $26 billion worth of chipmaking machinery, according to fresh trade data released by China’s General Administration of Customs this week, Bloomberg reports. Meanwhile, the global semiconductor manufacturing industry continued to show signs of improvement in Q2 2024 with significant growth of IC sales, stabilizing capital expenditure, and an increase in install... » read more

Chip Industry Technical Paper Roundup: August 13


New technical papers recently added to Semiconductor Engineering’s library: [table id=249 /] More ReadingTechnical Paper Library home   » read more

Flexible-Wafer Platform And CMOS-Compatible 300mm Wafer-Scale Integrated-Photonics Fabrication


A new technical paper titled "Mechanically-flexible wafer-scale integrated-photonics fabrication platform" was published by researchers at MIT and New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES). Abstract "The field of integrated photonics has advanced rapidly due to wafer-scale fabrication, with integrated-photonics platforms and fabric... » read more

Chip Industry Week In Review


BAE Systems and GlobalFoundries are teaming up to strengthen the supply of chips for national security programs, aligning technology roadmaps and collaborating on innovation and manufacturing. Focus areas include advanced packaging, GaN-on-silicon chips, silicon photonics, and advanced technology process development. Onsemi plans to build a $2 billion silicon carbide production plant in the ... » read more

Chip Industry Week In Review


JEDEC and the Open Compute Project rolled out a new set of guidelines for standardizing chiplet characterization details, such as thermal properties, physical and mechanical requirements, and behavior specs. Those details have been a sticking point for commercial chiplets, because without them it's not possible to choose the best chiplet for a particular application or workload. The guidelines ... » read more

Chip Industry’s Technical Paper Roundup: July 18


New technical papers recently added to Semiconductor Engineering’s library: [table id=118 /] (more…) » read more

TaN Nanowires At 300 mm Wafer Scale For Quantum Computing And More


A technical paper titled "Ultra-thin TaN Damascene Nanowire Structures on 300 mm Si Wafers for Quantum Applications" was published by researchers at NY CREATES, United States Air Force Research Laboratory and SUNY Polytechnic Institute. Abstract: "We report on the development and characterization of superconducting damascene tantalum nitride (TaN) nanowires, 100 nm to 3 μm wide, with TaN thi... » read more

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