Manufacturing Bits: Sept. 8

By Mark LaPedus - 08 Sep, 2015 - Comments: 0

World’s pressure record The University of Bayreuth and the Deutsches Elektronen-Synchrotron (DESY) have set another world’s record for the highest static pressure ever achieved in a lab. Researchers were able to demonstrate metal osmium at pressures of up to 770 Gigapascals (GPa). Osmium is one of the world’s most incompressible metals. The 770 GPa figure is about 130 GPa higher than ... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 10 Jul, 2015 - Comments: 0

An alliance led by IBM Research has produced the semiconductor industry’s first 7nm test chips with functioning transistors. The breakthrough, accomplished in partnership with GlobalFoundries and Samsung at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering, could result in the ability to place more than 20 billion tiny switches, or transistors, on a chip. There i... » read more

Manufacturing Bits: April 28

By Mark LaPedus - 28 Apr, 2015 - Comments: 0

CIA and 3D printers Voxel8, a supplier of 3D printers, has closed a strategic investment and technology development agreement with In-Q-Tel (IQT), the venture capital arm of the U.S. Central Intelligence Agency (CIA). Voxel8, founded by technologists from Harvard University, is commercializing a new platform for 3D printing. The company enables engineers to create products with embedded 3D ... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 06 Jun, 2014 - Comments: 0

To help fab tool vendors, Imec has formally launched what it calls a “suppliers hub.” This program aims to offer an open R&D platform, which enables chip suppliers and tool makers to collaborate more deeply and in an earlier stage in the process. D2S has acquired the assets of Gauda, a developer of GPGPU-based computational lithography acceleration technology headquartered in Sunnyvale,... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Manufacturing Bits: Sept. 8

The Week In Review: Manufacturing

Manufacturing Bits: April 28

The Week In Review: Manufacturing

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