Blog Review: June 24


Cadence's Paul McLellan provides an overview of the new IEEE 1838 standard for manufacturing test of 3D stacked ICs and how it aims to enable testing of multi-die chiplet-based designs. In a video, Mentor's Colin Walls investigates the scope and lifetime of pointers in embedded applications. A Synopsys writer checks out the latest mobile memory standard, JESD209-5A, and the enhancements i... » read more

Startup Funding: April 2020


It was another strong month for automotive startups, with one autonomous trucking company in China drawing a massive $100M investment. Another hot area was optimization of machine learning deployments, including one new company launch. Quantum computing, etch equipment, and mmWave feature in this month's look at twenty-two startups that collectively raised $375M. Semiconductors & design ... » read more