Blog Review: June 24

3D test; embedded pointers; LPDDR5 updates; ML side-channel vulnerabilities.


Cadence’s Paul McLellan provides an overview of the new IEEE 1838 standard for manufacturing test of 3D stacked ICs and how it aims to enable testing of multi-die chiplet-based designs.

In a video, Mentor’s Colin Walls investigates the scope and lifetime of pointers in embedded applications.

A Synopsys writer checks out the latest mobile memory standard, JESD209-5A, and the enhancements it contains to the existing LPDDR5 standard, including support for Partial Array Refresh Control, Refresh Management, Enhanced Write Clock Always On Mode, and Optimized Refresh.

Rambus’ Paul Karazuba takes a look at what makes machine learning models vulnerable to side-channel attacks and why differential power analysis detection and prevention techniques are needed for edge devices.

In a blog for Arm, OctoML’s Logan Weber and Andrew Reusch explain how optimizing and deploying machine learning workloads to bare-metal devices is becoming easier with Apache TVM and broad framework support, compiler middleware, and flexible autotuning and compilation capabilities.

Ansys’ Patrick Boussard and Santosh Kottalgi consider how sound impacts perception of a product and the role of acoustic simulation in designing the functional aspects of a product.

In a blog for SEMI, McKinsey & Company’s Ondrej Burkacky looks at potential scenarios for global GDP recovery and the semiconductor demand forecast for 2020 and 2021.

Silicon Labs’ May Ledesma and Kris Young point to the increasing challenges in wireless coexistence when different wireless protocols share the same band and the impacts on IoT applications.

Western Digital’s Yosi Pinto takes a look back at the twenty year history of the SD card and how it enabled portable devices.

For more good reading, don’t miss the blogs featured in the latest Manufacturing, Packaging & Materials newsletter:

Editor In Chief Ed Sperling spells out why advanced nodes make sense for more companies.

Executive Editor Mark LaPedus observes that demand is strong for mature process nodes.

SEMI’s Bettina Weiss and Sven Beiker summarize where microelectronics are driving major trends in the automotive industry.

eBeam highlights a talk by Leo Pang, Chief Product Officer of D2S, on mask-wafer co-optimization for faster curvilinear ILT.

Coventor’s Benjamin Vincent outlines the benefits and challenges of a new, next-generation semiconductor architecture.

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