Week In Review: Manufacturing, Test

By Mark LaPedus - 19 Apr, 2019 - Comments: 0

Chipmakers Here comes the battle between 5nm and 6nm processes at two foundry vendors—Samsung and TSMC. Meanwhile, Intel is behind and scrambling to get 10nm out the door. (Intel's 10nm is equivalent to 7nm from the foundries.) Last week, TSMC announced delivery of a complete version of its 5nm design infrastructure. TSMC’s 5nm technology is based on a finFET. This week, Samsung anno... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 19 Apr, 2019 - Comments: 0

Internet of Things Combining artificial intelligence with unmanned aerial vehicles could provide a quicker and safer alternative to inspecting roadways for cracks, potholes, and other damage, according to a paper posted on arvix.org. “[M]anual visual inspection [is] not only tedious, time-consuming, and costly, but also dangerous for the personnel. Furthermore, the detection results are alwa... » read more

Week In Review: Design, Low Power

By Jesse Allen - 19 Apr, 2019 - Comments: 0

Intel acquired vision and video FPGA IP company Omnitek. Founded in 1998, the Basingstoke, England-based company has produced FPGA IP cores for video processing including conversion and enhancement, creating arbitrary image warps on a real time video stream, connectivity, and deep learning and AI inferencing. Terms of the deal were not disclosed. Qualcomm and Apple have dropped all litigatio... » read more

The Week In Review: Design

By Jesse Allen - 10 Feb, 2017 - Comments: 0

IP Rambus unveiled High Bandwidth Memory (HBM) Gen2 PHY developed for GlobalFoundries' FX-14 ASIC platform. The PHY, targeted at networking and data center applications, is fully compliant with the JEDEC HBM2 standard and supports data rates up to 2000 Mbps per data pin, for a total bandwidth of 256 GB/s. Omnitek launched a number of new FPGA-based video IPs, including HDMI2.0 Tx and Rx, ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Omnitek

Week In Review: Manufacturing, Test

Week in Review: IoT, Security, Auto

Week In Review: Design, Low Power

The Week In Review: Design