Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

Auto Safety Tech Adds New IC Design Challenges


The role of AI/ML in automobiles is widening as chipmakers incorporate more intelligence into chips used in vehicles, setting the stage for much safer vehicles, fewer accidents, but much more complex electronic systems. While full autonomy is still on the distant horizon, the short-term focus involves making sure drivers are aware of what's going on around them — pedestrians, objects, or o... » read more

Big Changes Ahead For Inside Auto Cabins


The space we occupy inside our vehicles is poised to change from mere enclosure to participant in the driving experience. Whether for safety or for comfort, a wide range of sensors are likely to appear that will monitor the “contents” of the vehicle. The overall approach is referred to as an in-cabin monitoring system (ICMS), but the specific applications vary widely. “In-cabin sensing... » read more