Week in Review: IoT, Security, Auto

By Jeff Dorsch - 12 Jul, 2019 - Comments: 0

Products/Services Arteris IP reports that Bitmain licensed the Arteris Ncore Cache Coherent Interconnect intellectual property for use in its next-generation Sophon Tensor Processing Unit system-on-a-chip devices for the scalable hardware acceleration of artificial intelligence and machine learning algorithms. “Our choice of interconnect IP became more important as we continued to increase t... » read more

Security Gap Grows

By Ed Sperling - 09 Jul, 2018 - Comments: 1

There is far more talk about security in designs these days, and far more security features being added into chips and systems. So why isn't it making a dent in the number of cyberattacks? According to the Online Trust Alliance, there were 159,700 cyber incidents in 2017 around the globe. But the group notes that because most incidents are not reported, the real number could be twice as lar... » read more

The Week In Review: IoT

By Jeff Dorsch - 16 Dec, 2016 - Comments: 0

Tools Google this week updated its Internet of Things platform, releasing a Developer Preview for Android Things, enabling application developers to create IoT devices running on the mobile Android operating system. “We incorporated the feedback from Project Brillo to include familiar tools such as Android Studio, the Android Software Development Kit (SDK), Google Play Services, and Google C... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Online Trust Alliance

Week in Review: IoT, Security, Auto

Security Gap Grows

The Week In Review: IoT

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