tag: Open-Silicon

From Specification To Chip: A Holistic Design Approach
By Kalpesh Sanghvi - 18 Dec, 2014 - Comments: 0

Chip design is getting more and more challenging in terms of power, performance, area and IP integration. At the same time, competition and time-to-market are forcing much tighter schedules. The traditional ASIC design approach taken by OEMs is to handle the majority of front-end design in-house, and then hand off either register-transfer level (RTL) code or a netlist to an outside vendor, who ... » read more

Signal And Power Integrity Cross Paths
By Ed Sperling - 05 Dec, 2014 - Comments: 2

Signal integrity and power integrity historically have been relatively independent issues, and engineers with expertise in one area generally operate independently of the other. But as more power domains are added to conserve energy and allow more features, as voltages are reduced to save battery life, and as dynamic power becomes more of a concern at advanced nodes, these worlds are suddenly m... » read more

Virtual Prototyping Takes Off
By Ed Sperling - 03 Dec, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss [getkc id="104" kc_name="virtual prototyping"] with Barry Spotts, senior core competency FAE for fabric and tools at [getentity id="22186" comment="ARM"]; Vasan Karighattam, senior director of architecture for SoC and SSW engineering at [getentity id="22664" e_name="Open-Silicon"]; Tom De Schutter, senior product marketing manager for Virtualizer So... » read more

Blog Review: Nov. 26
By Ed Sperling - 26 Nov, 2014 - Comments: 0

Mentor's Nazita Saye has stumbled on a defibrillating drone that can rescuscitate victims well before emergency services arrive. That's a new one. ARM's Brad Nemire has found an interesting new Kickstarter device, too. It measures everything from heart beat to body posture with earlobe sensors. Cadence's Brian Fuller follows a speech by economist Austan Goolsbee, who is optimistic about t... » read more

Virtual Prototyping Takes Off
By Ed Sperling - 25 Nov, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss [getkc id="104" kc_name="virtual prototyping"] with Barry Spotts, senior core competency FAE for fabric and tools at [getentity id="22186" comment="ARM"]; Vasan Karighattam, senior director of architecture for SoC and SSW engineering at [getentity id="22664" e_name="Open-Silicon"]; Tom De Schutter, senior product marketing manager for Virtualizer S... » read more

The Week In Review: Design/IoT
By Ed Sperling - 21 Nov, 2014 - Comments: 0

IoT The first test drive to showcase intelligent traffic was held in Europe this week. NXP, Siemens, Honda, Cohda Wireless, TÜV Süd, and Automobile Clubs AvD and ANWB are all working within the Intelligent Transport Systems Corridor that runs between Austria, German and the Netherlands. IP Open-Silicon rolled out memory controller IP for the Hybrid Memory Cube 2.0 standard. The 3D stacke... » read more

Conflicting Needs For IoT Edge Designs
By Ed Sperling - 20 Nov, 2014 - Comments: 1

The mad rush has begun to hype the [getkc id="76" comment="Internet of Things"], but the path forward isn't quite as straightforward as the marketers would like it to be. ICs used at the edge of the IoT—the ones that gather information to be controlled by smart phones or tablets and transmitted to devices for processing and data analytics—need to be designed differently than the initial for... » read more

Hybrid Memory Cube – Ready For Prime Time
By Manohar Ayyagiri - 20 Nov, 2014 - Comments: 0

With the release this week of Hybrid Memory Cube (HMC) 2.0, designers can get their hands on mature, standards-based IP that can be used to significantly scale the performance of servers and data centers. HMC offers bandwidths up to 320 GB/s – 12X that of standard memory solutions like DDR4 – while consuming significantly less power. These benefits are too significant to ignore for ASIC, So... » read more

An Inside Look At The GlobalFoundries-IBM Deal
By Ed Sperling - 20 Nov, 2014 - Comments: 3

GlobalFoundries' proposed acquisition of IBM Microelectronics is the kind of deal that will have business schools talking for many years to come—a gargantuan combination of expertise and technology, built on the back of high-profile business successes and failures, long-running legal struggles and global politics—with far-reaching implications for all parts of the semiconductor supply chain... » read more

Virtual Prototyping Takes Off
By Ed Sperling - 06 Nov, 2014 - Comments: 0

Semiconductor Engineering sat down with Barry Spotts, senior core competency FAE for fabric and tools at [getentity id="22186" comment="ARM"]; Vasan Karighattam, senior director of architecture for SoC and SSW engineering at [getentity id="22664" e_name="Open-Silicon"]; Tom De Schutter, senior product marketing manager for Virtualizer Solutions at [getentity id="22035" e_name="Synopsys"]; Larry... » read more

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