The Week In Review: Design/IoT

Intelligent traffic corridor opens in Europe; Open-Silicon rolls out Hybrid Memory Cube 2.0 controller IP; Synopsys adds IP prototyping kits; PathScale uncorks ARM compiler; Rambus teams with Mobiveil for memory subsystem.


The first test drive to showcase intelligent traffic was held in Europe this week. NXP, Siemens, Honda, Cohda Wireless, TÜV Süd, and Automobile Clubs AvD and ANWB are all working within the Intelligent Transport Systems Corridor that runs between Austria, German and the Netherlands.

Open-Silicon rolled out memory controller IP for the Hybrid Memory Cube 2.0 standard. The 3D stacked memory-on-logic uses through-silicon vias to achieve data rates of up to 30 gigabits per second. Open-Silicon said it already is working with a customer to integrate the new IP into high-speed networking equipment.

Synopsys added IP prototyping kits for 10 interface protocols ranging from USB 3.0 to PCIe 3.0 to MIPI CSI-2. The company says the kits can reduce prototyping and integration time by up to six weeks.

ARM partner PathScale unveiled a compiler for ARM-base servers for HPC applications. The alpha version of the compiler and libraries will be available next month.

Synopsys won a deal with Oticon, which is using its RTL synthesis tools for improving area, power and performance for its hearing aids. Synopsys also won a deal with U.K.-based Plastic Logic, which is using Synopsys’ physical verification tools for organic thin film transistor technology. Plastic Logic makes flexible screens and sensors.

Rambus and Mobiveil have teamed up to create a memory subsystem based on Mobiveil’s universal multiport memory controller core and Rambus’ DDR4 multi-modal PHY. The core is configurable and is aimed at next-gen mobile, networking and consumer applications.

SemIsrael Expo will be held on Nov. 25 at Airport City, Israel.

3D Architectures for Semiconductor Integration and Packaging, Dec. 10-12, Hyatt Regency San Francisco Airport, Burlingame, CA.

Cadence will host a Front-End Design Summit on Dec. 11 at it headquarters.

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