A new technical paper titled "Polycrystalline silicon PhC cavities for CMOS on-chip integration" was published by researchers at Tyndall National Institute, Munster Technological University, and Université Grenoble Alpes, CEA, LETI.
"In this work, we present an on-chip 2D and 3D photonics integration solution compatible with Front End of Line integration (FEOL) using deposited polycrystalli...
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