An Integrated Fabrication Approach For Fully EHD-Printed Flexible Organic Thin Film Transistors (OTFTs)

By Technical Paper Link - 06 Jul, 2023 - Comments: 0

A technical paper titled "All Electrohydrodynamic Printed Flexible Organic Thin Film Transistors" was published by researchers at North Carolina State University. Abstract: "The demand of cost-effective fabrication of printed flexible transistors has dramatically increased in recent years due to the need for flexible interface devices for various application including e-skins, wearables, and ... » read more

Vertically stacked, low-voltage organic ternary logic circuits including nonvolatile floating-gate memory transistors

By Technical Paper Link - 02 May, 2022 - Comments: 0

Research paper from KAIST and Gachon University. Abstract "Multi-valued logic (MVL) circuits based on heterojunction transistor (HTR) have emerged as an effective strategy for high-density information processing without increasing the circuit complexity. Herein, an organic ternary logic inverter (T-inverter) is demonstrated, where a nonvolatile floating-gate flash memory is employed to ... » read more

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tag: Organic thin-film transistors

An Integrated Fabrication Approach For Fully EHD-Printed Flexible Organic Thin Film Transistors (OTFTs)

Vertically stacked, low-voltage organic ternary logic circuits including nonvolatile floating-gate memory transistors

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tag: Organic thin-film transistors

An Integrated Fabrication Approach For Fully EHD-Printed Flexible Organic Thin Film Transistors (OTFTs)

Vertically stacked, low-voltage organic ternary logic circuits including nonvolatile floating-gate memory transistors

Trending Articles

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

2D Semiconductors Make Progress, But So Does Silicon

Knowledge Centers Entities, people and technologies explored

Related Articles

Partitioning In The Chiplet Era

3.5D: The Great Compromise

Legacy Process Nodes Going Strong

AI’s Role In Chip Design Widens, Drawing In New Startups

Key Technologies To Extend EUV To 14 Angstroms

Memory Fundamentals For Engineers

What Comes After HBM For Chiplets

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