Week In Review: Manufacturing, Test

By Mark LaPedus - 05 Jul, 2019 - Comments: 0

Fab tools and materials Applied Materials has signed a definitive agreement to acquire Kokusai Electric for $2.2 billion in cash from investment firm KKR. With the acquisition of Kokusai’s semiconductor equipment unit, Applied expands its customer base and gains a foothold in the batch processing equipment business, where a tool can process wafers in parallel. Applied’s strength is in the ... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 21 Dec, 2018 - Comments: 0

Chipmakers Foxconn is in talks to build a fab in Zhuhai, China, according to a report from Nikkei. The fab, to cost $9 billion, would make chips for Foxconn and outside companies, the report said, which says the company will enter the foundry business. The European Commission has approved funding for 1.75 billion euros ($2 billion) of public investment for projects in the microelectronics... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 04 May, 2018 - Comments: 0

Chipmakers Consumers recently filed a class-action suit against the three DRAM makers, alleging that they illegally agreed to raise prices for their respective memory products. The suit, filed in the U.S. District Court for the Northern District of California, alleges that Samsung, Micron and Hynix agreed to limit the supply of DRAM, driving up prices for this widely used memory. The pri... » read more

LiDAR Goes Back To The Future

By Jeff Dorsch - 12 Mar, 2018 - Comments: 0

LiDAR is emerging as an increasingly important piece of the enabling technology in autonomous driving, along with advanced computer vision and radar sensor chips. But LiDAR systems also are finding their way into a variety of other applications, such as industrial automation, including robotics, and unmanned aerial vehicles. Advanced mapping is another rapidly growing market for LiDAR, which... » read more

Manufacturing Bits: Nov. 11

By Mark LaPedus - 11 Nov, 2014 - Comments: 0

Plastic smartwatch displays LG Display has begun production of what the company claims is the world’s first circular plastic OLED (P-OLED) display. The P-OLED is the display for the company’s new smartwatch, the LG G Watch R. Based on the Android Wear operating system, the smartwatch is powered by Qualcomm’s 1.2-GHz Snapdragon 400 processor. It also has 4GB of storage and 512MB of RAM... » read more

How To Lower LED Costs

By Mark LaPedus - 17 Jul, 2014 - Comments: 2

The LED market remains hot, particularly in the solid-state lighting segment. In fact, solid-state lighting continues to expand amid a precipitous drop in LED prices. And LEDs are expanding into new fronts, such as automotive and intelligent lighting. The LED boom hasn’t been fun for all parties, however. Amid pressure to reduce their tool costs, LED equipment makers are still in the mids... » read more

OLED Displacing LCD, But Not Affecting Industry Leaders

By Michael Watts - 25 Jun, 2013 - Comments: 0

By Michael P.C. Watts One of the most common themes in high tech is how companies fail to deal with game-changing new products. Think about Kodak and digital cameras, Sony and the flash memory music player, Microsoft and the tablet, GE and Osram and the Light Emitting Diode (LED). The overwhelming conclusion seems to be that you have to be committed to making your own most valuable product red... » read more

LED Firms Mull New Wafer Sizes And Materials

By Ed Sperling - 16 Aug, 2012 - Comments: 0

By Mark LaPedus Seeking to reduce the cost of solid-state lighting and related applications, LED manufacturers are taking a page from the IC industry: They are looking at larger wafer sizes and new materials in the fab. Today, the state-of-the-art LED fab is a 150mm (6-inch) facility, but a large percentage of these plants are still using 50mm (2-inch) substrates. The vast majority of LED s... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Osram

Week In Review: Manufacturing, Test

Week In Review: Manufacturing, Test

The Week In Review: Manufacturing

LiDAR Goes Back To The Future

Manufacturing Bits: Nov. 11

How To Lower LED Costs

OLED Displacing LCD, But Not Affecting Industry Leaders

LED Firms Mull New Wafer Sizes And Materials