Manufacturing Bits: August 25

By Mark LaPedus - 25 Aug, 2015 - Comments: 0

South Pole neutrinos A group of researchers using an instrument buried deep in the ice at the South Pole have announced a new observation of high-energy neutrinos from beyond our solar system and the galaxy. The IceCube Neutrino Observatory, a cubic-kilometer-sized detector sunk into the ice sheet at the South Pole, allows researchers to see the byproducts of neutrino interactions with the ... » read more

Manufacturing Bits: Dec. 16

By Mark LaPedus - 16 Dec, 2014 - Comments: 0

Space DSA NASA's Physical Science Research Program is taking directed self-assembly (DSA) technology to new heights. On the International Space Station, astronauts are exploring the development of nanoparticles suspended in magnetorheolocial (MR) fluids. MR fluids, which are a new class of smart materials, self-assemble into shapes in the presence of a magnetic field. With the technology, r... » read more

Disruptive R&D

By Paula Doe - 17 Jul, 2014 - Comments: 0

Leading university researchers presented their most promising technologies — describing developments ranging from sustainable metal cluster technology (that’s already spawned three notable startups) to resonance-based detection for more accurate MEMS devices — at the new Breakthrough Research Technologies session and the Silicon Innovation Forum at SEMICON West 2014. OSU metal cluster... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: OSU

Manufacturing Bits: August 25

Manufacturing Bits: Dec. 16

Disruptive R&D