Week In Review: Manufacturing, Test

By Mark LaPedus - 08 Oct, 2021 - Comments: 0

Government policy Hoping to resolve the ongoing worldwide chip shortage situation, the U.S. Department of Commerce late last month launched a “request for information (RFI)” initiative, which involved sending questionnaires to various semiconductor companies. The U.S. government is asking all parts of the supply chain – producers, consumers, and intermediaries – to voluntarily share in... » read more

Angstrom-Level Measurements With AFMs

By Mark LaPedus - 19 Aug, 2021 - Comments: 0

Competition is heating up in the atomic force microscopy (AFM) market, where several vendors are shipping new AFM systems that address various metrology challenges in packaging, semiconductors and other fields. AFM, a small but growing field that has been under the radar, involves a standalone system that provides surface measurements on structures down to the angstrom level. (1 angstrom = 0... » read more

Atomic Layer Etch Expands To New Markets

By Mark LaPedus - 16 Jul, 2020 - Comments: 0

The semiconductor industry is developing the next wave of applications for atomic layer etch (ALE), hoping to get a foothold in some new and emerging markets. ALE, a next-generation etch technology that removes materials at the atomic scale, is one of several tools used to process advanced devices in a fab. ALE moved into production for select applications around 2016, although the technolog... » read more

System Bits: July 15

By Jeff Dorsch - 15 Jul, 2019 - Comments: 0

Automating bridge inspections with robotics The University of Waterloo has come up with robotics that could be used in automated inspection of bridges, making sure such critical infrastructure is safe and sound. The technology promises to make bridge inspection cheaper and easier. The system collects data for defect detection and analysis through a combination of autonomous robots, cameras,... » read more

Power/Performance Bits: Oct. 25

By Jesse Allen - 25 Oct, 2016 - Comments: 0

Energy-harvesting floor Engineers at the University of Wisconsin-Madison developed a flooring material which can be used as a triboelectric nanogenerator to convert footsteps into electricity. The method uses wood pulp, a common waste material already often used in flooring. The pulp is partly make of cellulose nanofibers, which when chemically treated produce an electrical charge when th... » read more

Manufacturing Bits: June 17

By Mark LaPedus - 17 Jun, 2014 - Comments: 1

PiezoFET debuts The University of Twente MESA+ Research Institute and SolMateS have put a new twist on the finFET. A piezoelectric stressor layer has been deposited around the finFET, thereby enabling what researchers call the PiezoFET. The PiezoFET could enable steep sub-threshold slope devices. In the lab, this device was also able to reduce the leakage by a factor of five. [caption id... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer