DRAM Test And Inspection Just Gets Tougher


DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming much more difficult with the rollout of faster interfaces and multi-chip packages. DRAM plays a key role in a wide variety of electronic devices, from phones and PCs to ECUs in cars and servers ins... » read more

Mission-Critical Devices Drive System-Level Test Expansion


System-level testing is becoming essential for testing complex and increasingly heterogeneous chips, driven by rising demand for reliable parts in safety- and mission-critical applications. More and more chip manufacturers are jumping on the SLT bandwagon for high-volume manufacturing (HVM) of these devices. Unlike ATE and packaged device testing, SLT mimics actual semiconductor system opera... » read more

Site-To-Site Variation In Parallel Test


From wafer to system level test, parallel test execution delivers significant benefits, including reduced costs, yet it’s never as simple as that PowerPoint slide you present to management. An engineering effort is required to balance the thermo-electrical challenges that occur as you increase the number of sites to be tested, or the number of slots in a burn-in oven or system level te... » read more

Coping With Parallel Test Site-to-Site Variation


Testing multiple devices in parallel using the same ATE results in reduced test time and lower costs, but it requires engineering finesse to make it so. Minimizing test measurement variation for each device under test (DUT) is a multi-physics problem, and it's one that is becoming more essential to resolve at each new process node and in multi-chip packages. It requires synchronization of el... » read more