Making Drones Secure

By John Edwards - 01 Sep, 2016 - Comments: 0

Critics have accused drones of creating multiple dangers, including invading privacy, colliding with other aircraft, threatening personal safety and even frightening livestock. Yet the biggest drone threat of all may turn out to be attacks made on the vehicles themselves. Drones, also known as UAVs (unmanned aerial vehicles) and UASs (unmanned aerial systems), need a variety of internal ... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 18 Dec, 2015 - Comments: 1

Samsung plans to make a major entry into the drone market, according to reports. “Samsung is not alone in focusing on the drone market,” said Will Strauss, president of Forward Concepts, in a research note. “At CES next month in Las Vegas, one can expect new products from drone market leader DJI, but dozens of new drone models from Parrot and many other companies. Even GoPro chip maker A... » read more

How I Survived CES

By Brian Fuller - 15 Jan, 2015 - Comments: 0

To come away from the annual Consumer Electronics Show with a shred of sanity, you need to focus on what matters. It’s easy not to. The minute you step foot into the crush of any exhibit floor you’re dragged into a massive undertow of technology that’s hard to swim from. The hype is palpable, the noise deafening, the products endless. Because of this sensory overload, it’s easy to la... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Parrot

Making Drones Secure

The Week In Review: Manufacturing

How I Survived CES