A Novel Photosensitive Permanent Bonding Material Designed For Polymer/Metal Hybrid Bonding Applications

Wafer-level hybrid bonding techniques, which provide simultaneous bonding between metal-metal and dielectric-dielectric layers, have attracted more attention in recent years for fabricating 3D integrated circuits with high bandwidth and high interconnect density. However, there are some issues for conventional hybrid bonding using silicon oxide as the dielectric, such as the high stress and low... » read more