The Third Generation Of FPGA Prototyping

By Robert Parris - 22 Dec, 2021 - Comments: 0

Bench setups with physical prototypes lie at the very heart of electrical and electronic engineering. With all due respect to the many powerful forms of modeling and simulation, at some point the engineering team wants to work with hardware. When a system is built entirely from existing components, it is possible to build a prototype of the product as soon as it has been designed. When the desi... » read more

Team Work

By Tom De Schutter - 29 Sep, 2016 - Comments: 0

While I am not much of a golf player, I participated in a golf tournament over the summer. It was a very friendly setup with teams of four playing against each other. Each player of the team hits his ball, and the ball that lands in the best position determines the starting point for every one of the team for the next stroke. The fact that only the best shot of the team counts, definitely ma... » read more

Blurring The Lines On Prototyping

By Ann Mutschler - 23 Apr, 2015 - Comments: 0

Prototyping is an integral part of every [getkc id="81" kc_name="SoC"] today, with two main approaches being used: virtual or software-based, and physical, which includes FPGA-based boards as well as hardware emulation systems. [getkc id="104" kc_name="Virtual prototyping"] is typically used for software development in the early stages of SoC design, even before SoC [getkc id="49" kc_name="R... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: physical prototyping

The Third Generation Of FPGA Prototyping

Team Work

Blurring The Lines On Prototyping