Plasma Dicing 101: The Basics

Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A saw blade, or laser, is used to cut the wafer along the areas between the chips called dicing lanes. This step separates the chips from the wafer making them ready to be packaged and fitted to whiche... » read more

Challenges With Chiplets And Packaging

Semiconductor Engineering sat down to discuss IC packaging technology trends, chiplets, shortages and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of global technical marketing at JCET; and Th... » read more