ML Focus Shifting Toward Software

By Bryon Moyer - 03 Feb, 2022 - Comments: 1

New machine-learning (ML) architectures continue to garner a huge amount of attention as the race continues to provide the most effective acceleration architectures for the cloud and the edge, but attention is starting to shift from the hardware to the software tools. The big question now is whether a software abstraction eventually will win out over hardware details in determining who the f... » read more

Network Interface Card Evolution

By Ed Sperling - 31 Mar, 2021 - Comments: 0

Longer chip lifetimes, more data to process and move, and a slowdown in the rate of processor improvements has created a series of constantly shifting bottlenecks. Kartik Srinivasan, director of data center marketing at Xilinx, looks at one of those bottlenecks, the network interface card, why continuous enhancements and changes will be required, and how to extend the life of NICs as the networ... » read more

Tech Talk: DO-254

By Ed Sperling - 24 Aug, 2017 - Comments: 0

Aldec's Louie De Luna explains the safety critical standard for the aerospace industry and how that parallels what's happening in automotive electronics. https://youtu.be/qa1g1NNVj60 » read more

End User Report: Reliability

By Ed Sperling - 15 Oct, 2009 - Comments: 0

John Kern, vice president of product operations inside Cisco Systems’ customer value chain management group, sat down with Low-Power Engineering to talk about the company’s internal focus on reliability and what factors are causing the most concern. What follows are excerpts of that conversation. By Ed Sperling LPE: How does Cisco gauge reliability? John Kern: The bulk of our re... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: PLD

ML Focus Shifting Toward Software

Network Interface Card Evolution

Tech Talk: DO-254

End User Report: Reliability