The LiDAR Gold Rush

By Jeff Dorsch - 12 Jun, 2017 - Comments: 0

Big money is pouring into the LiDAR market, as carmakers gear up for autonomous and assisted driving. LiDAR, along with advanced computer vision and radar sensors, is an essential component for vehicles to maneuver without hitting obstacles or other cars. LiDAR is an acronym for light imaging, detection, and ranging, and until now it has been almost synonymous with next-generation automotive... » read more

The Future Of Sports Cars

By Ed Sperling - 11 May, 2017 - Comments: 1

The introduction of autonomous vehicles will have a huge effect on the car market, but not for the obvious reasons—and not necessarily in the time frame that most people expect. Numerous sources say one automakers are very concerned about what kinds of vehicles people will buy once cars are autonomous. What will differentiate one car from another? And what will become of brands such as Por... » read more

Automotive Electronic Power

By Barry Pangrle - 27 Jul, 2015 - Comments: 2

Nick Hendricks: I was drag racing. I'm a drag racer. Detective Samson: You were drag racing. Nick Hendricks: [nods] Detective Samson: In a Prius. Nick Hendricks: I don't win a lot. —Horrible Bosses (2011) Automobiles are now a platform for multiple electronic devices. From controllers for complex hybrid drive systems like those found in the Toyota Prius to all types of entertainment s... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Porsche

The LiDAR Gold Rush

The Future Of Sports Cars

Automotive Electronic Power