Successful Design Of Power Management Chips


With an industry as large as semiconductors, there are often surprises lurking in some of the more specialized product categories. Everyone knows that huge chips such as CPUs and GPUs command high prices and that memory chips are ubiquitous. However, the domain of power management integrated circuits (PMICs) is less well known to many observers. PMICs are impressive in terms of their technol... » read more

Silicon Carbide And Gallium Nitride Bring New Challenges For Semiconductor Test


In the era of megatrends such as electric vehicles (EVs), new technologies are emerging to keep up with evolving demands. One example of this is the evolution of compound semiconductors that use silicon carbide (SiC) and gallium nitride (GaN) for high-performance power systems. Innovating test protocols to handle wide bandgap materials For many power-related applications, the semiconductor in... » read more

Research Bits: Oct. 29


Micro-LED DUV maskless lithography Researchers from the University of Science and Technology of China, Anhui GaN Semiconductor, and Wuhan University developed a vertically integrated micro-LED array for deep ultraviolet (DUV) maskless photolithography. The team fabricated a DUV display integrated chip with 564 pixels-per-inch density that uses a three-dimensional vertically integrated devic... » read more

Sustainable Rail Transportation With High Power SiC Modules: Part 2


In the first part of this blog, we had a look at how energy-efficient high-power modules contribute to the decarbonization of railway transportation. This part will focus on the future of traction: high-power silicon carbide modules, their key features, and the multiple system benefits they enable. Silicon carbide power modules and hybrid-propulsion trains: It’s a match! As we inch toward... » read more

Non-Destructive Measurement of Bottom Width in Deep Trench Isolation Structures using IRCD Metrology


As scaling in semiconductor devices continues, the aspect ratios of deep trench isolation (DTI) structures have increased. DTI structures are used in power devices, power management ICs and image sensors as a method to isolate active devices by reducing crosstalk, parasitic capacitance, latch-up and allowing for an increase breakdown voltage of active devices. Measurement of these structures in... » read more

Sustainable Rail Transportation With High Power SiC Modules: Part 1


The process of electrification of railways, though crucial for achieving net-zero climate targets, is nevertheless far from being complete.  Let's delve into how high-power semiconductor technologies are accelerating the decarbonization of rail transport, making it cleaner, safer, and smarter. Decarbonization of transportation: Unraveling the global picture According to the International Ene... » read more

Automotive Semiconductors Require Integrated Test Solution


The automotive semiconductor test market is experiencing organic growth as chipmakers produce higher volumes of devices serving an array of automotive applications. In addition, the range of applications for automotive-grade semiconductors is evolving as the technology advances. Manufacturers of automated test equipment (ATE) are adapting to ensure their systems can handle devices ranging from ... » read more

Power Stage Selection Considerations For High-Current Voltage Regulators


There are several key things to consider when selecting a power stage for high-current voltage regulators: What area does the power stage need to fit in? What is the continuous output current? What is the maximum peak current? This should not exceed the peak current rating of the power stage. What is the power loss for sustained output current? This can be calculated... » read more

Liquid Cooling And GaN: A Winning Combination


Data centers are facing an unprecedented transformation due to the surge in generative AI and other emerging technologies. A single ChatGPT session consumes 50 to 100 times more energy than a comparable Google search, escalating data center rack power requirements towards 200 kW or more, presenting serious challenges for operators. Cooling, in fact, takes up about 40% of the power requireme... » read more

GaN Devices: Properties and Performance At Extremely High Temperatures


A new technical paper titled "High temperature stability of regrown and alloyed Ohmic contacts to AlGaN/GaN heterostructure up to 500 °C" was published by researchers at MIT, Technology Innovation Institute, Ohio State University, Rice University and Bangladesh University of Engineering and Technology. Abstract "This Letter reports the stability of regrown and alloyed Ohmic contacts to A... » read more

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