The Week In Review: Manufacturing

By Mark LaPedus - 25 Nov, 2016 - Comments: 0

R&D Amid budget cuts in the U.S. government, federal funding for R&D at higher education institutions in the United States declined for a fourth straight year, according to a new report from the National Center for Science and Engineering Statistics (NCSES). Overall, universities reported $68.8 billion in R&D expenditures in 2015, a 2.2% increase from 2014, according to the NCSES, part of t... » read more

Manufacturing Bits: Nov. 1

By Mark LaPedus - 01 Nov, 2016 - Comments: 0

U.S. to boost IC competitiveness President Obama’s Council of Advisors on Science & Technology (PCAST) has launched a new semiconductor working group in the United States. The new working group will focus on ways to strengthen the competitiveness of the U.S. semiconductor industry. It will provide recommendations to PCAST regarding the challenges facing the U.S. semiconductor industry. Th... » read more

President Obama Visits Applied Materials

By Applied Materials Writers - 16 May, 2013 - Comments: 0

By John Kania [caption id="attachment_8398" align="alignnone" width="518" caption="Applied Materials CEO Mike Splinter with President Barack Obama as they tour the Austin manufacturing clean room and hear from Applied employee Nilam D. Bhakta-Sahib about the complex chip making process. "][/caption] President Obama rode Air Force One into Austin, Texas, to shine a spotlight on the import... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: President Obama

The Week In Review: Manufacturing

Manufacturing Bits: Nov. 1

President Obama Visits Applied Materials