tag: printed electronics

Research Bits: Oct. 22
By Jesse Allen - 22 Oct, 2024 - Comments: 0

3D-printed active electronics Researchers from MIT demonstrated fully 3D-printed semiconductor-free resettable fuses. Produced using standard 3D printing hardware and an inexpensive, biodegradable polymer filament doped with copper nanoparticles, the device can perform the same switching functions as the semiconductor-based transistors used for processing operations in active electronics. A... » read more

Research Bits: Sept. 17
By Jesse Allen - 17 Sep, 2024 - Comments: 0

DNA data storage plus compute Researchers from North Carolina State University and Johns Hopkins University created a DNA-based device that can perform both data storage and computing functions. “Specifically, we have created polymer structures that we call dendricolloids – they start at the microscale, but branch off from each other in a hierarchical way to create a network of nanoscal... » read more

Scalable Fabrication of Graphene FETs on Non-Planar Surfaces (Imperial College London)
By Technical Paper Link - 12 Sep, 2024 - Comments: 0

A new technical paper titled "Fabrication of graphene field effect transistors on complex non-planar surfaces" was published by researchers at Imperial College London. Abstract "Graphene field effect transistors (GFETs) are promising devices for biochemical sensing. Integrating GFETs onto complex non-planar surfaces could uncap their potential in emerging areas of wearable electronics, such... » read more

Research Bits: Sept. 3
By Jesse Allen - 03 Sep, 2024 - Comments: 0

3D printing of specialized antennas, sensors Researchers from the National University of Singapore developed a 3D printing technique that can be used to create three dimensional, self-healing electronic circuits. Called tension-driven CHARM3D, the technique enables the 3D printing of free-standing metallic structures without requiring support materials and external pressure. It uses Field�... » read more

Research Bits: Mar. 11
By Jesse Allen - 11 Mar, 2024 - Comments: 0

Ferroelectric nanosheets Engineers from the University of Sydney, RMIT University, University of New South Wales, and University of Technology Sydney created a liquid metal alloy of tin, zirconium, and hafnium. The alloy has a thin oxide layer crust that enables it to be used to harvest ultra-thin tin oxide nanosheets doped with hafnium zirconium oxide, which could then be 2D printed on a subs... » read more

FLEX 2023 Takeaways: Flexible And Printed Electronics Move Into Electronics Manufacturing
By Gity Samadi - 17 Aug, 2023 - Comments: 0

By Gity Samadi and Paul Semenza The FLEX Conference, held again this year in conjunction with SEMICON West 2023, provided numerous examples of continued developments in flexible, printed, and flexible hybrid electronics technologies applied to sensing, robotics, communications, and other applications. At the same time, there is growing focus on applying various additive manufacturing equipme... » read more

Split Additive Manufacturing for Printed Neuromorphic Circuits (Karlsruhe Institute of Technology)
By Technical Paper Link - 05 May, 2023 - Comments: 0

A new technical paper titled "Split Additive Manufacturing for Printed Neuromorphic Circuits" was published by researchers at Karlsruher Institut für Technologie (KIT). Abstract: "Printed and flexible electronics promises smart devices for application domains, such as smart fast moving consumer goods and medical wearables, which are generally untouchable by conventional rigid silicon tech... » read more

Research Bits: May 2
By Jesse Allen - 02 May, 2023 - Comments: 0

Reconfigurable FeHEMT Researchers at the University of Michigan created a reconfigurable ferroelectric transistor that could enable a single amplifier to do the work of multiple conventional amplifiers. “By realizing this new type of transistor, it opens up the possibility for integrating multifunctional devices, such as reconfigurable transistors, filters and resonators, on the same plat... » read more

Research Bits: March 6
By Jesse Allen - 06 Mar, 2023 - Comments: 0

2D TMDs on silicon Engineers at MIT, University of Texas at Dallas, Institute for Basic Science, Sungkyunkwan University, Washington University in St. Louis, University of California at Riverside, ISAC Research, and Yonsei University found a way to grow 2D materials on industry-standard silicon wafers while preserving their crystalline form. Using a new “nonepitaxial, single-crystalline g... » read more

Printed Electronics: Direct Flipchip Bonding of Ultra-Thin Chip On A Recently-Developed Stretchable Substrate
By Technical Paper Link - 05 Mar, 2023 - Comments: 0

A new technical paper titled "Flip chip bonding on stretchable printed substrates; the effects of stretchable material and chip encapsulation" was published by researchers at Silicon Austria Labs and Institute for Smart Systems Technologies. Abstract "Stretchable printed electronics have recently opened up new opportunities and applications, including soft robotics, electronic skins, human-... » read more

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