Connecting The Car

By Ed Sperling - 22 Jun, 2017 - Comments: 0

K. Charles Janac, chairman and CEO of ArterisIP, sat down with Semiconductor Engineering to discuss changes in automotive and how the connected car will affect chip design and a multitude of other markets. What follows are excerpts of that conversation. SE: What is the biggest change you're seeing in semiconductors? Janac: The really big change is that mobility is flattening out. The mark... » read more

The Week In Review: IoT

By Jeff Dorsch - 09 Jun, 2017 - Comments: 0

Analysis Adam Greenfield writes about the privacy and technology issues raised by the Internet of Things in this piece, an adapted extract from his new book, "Radical Technologies: The Design of Everyday Life." “The Internet of Things presents many new possibilities, and it would be foolish to dismiss those possibilities out of hand. But we would also be wise to approach the entire domain wi... » read more

Smart Cities, Challenging Issues

By Gale Morrison - 01 Dec, 2016 - Comments: 0

Smart cities are coming. Not everything will be connected, and not everything will be connected at once. Still, governments around the globe are beginning to tap into a world of connected devices and sensors for reasons ranging from cheaper lighting to less traffic, lower crime, and improved air quality. Smart cities encompass all manner of usage models and equipment — parking meters, traf... » read more

Oh, The Hypocrisy

By Ernest Worthman - 03 Mar, 2016 - Comments: 1

It's almost impossible to find anyone hasn’t heard about the privacy case chest-thumping going on between Apple and the FBI, as well as a few other federal entities. And by now the interview with Tim Cook and David Muir is quite public, as well. So how come, all of a sudden, Apple, Microsoft (although Bill Gates did come out on the government side) Google, Yahoo, Facebook, and countless ot... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

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by Brian Bailey

Partitioning In The Chiplet Era

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by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

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by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: privacy

Connecting The Car

The Week In Review: IoT

Smart Cities, Challenging Issues

Oh, The Hypocrisy