tag: proelectric

Power/Performance Bits: Feb. 21

By Jesse Allen - 21 Feb, 2017 - Comments: 0

Harvesting energy from multiple sources Researchers from the University of Oulu in Finland found a particular type of perovskite, KBNNO, has the right properties to extract energy from multiple sources simultaneously. While perovskites are particularly known for their use as solar cells, certain minerals in the perovskite family show piezoelectric and pyroelectric (harvesting energy from ... » read more

Trending Articles

Chip Industry Week In Review

Auto chiplet consortium; more nuke plants for AI; critical IC materials risk; TIMs; Foxconn in Mexico; ML in auto MCUs; 3nm PHY chiplet; chip health monitoring; AI test.

by The SE Staff

Metrology Advances Step Up To Sub-2nm Device Node Needs

Fab processes that enable stacked transistors, hybrid bonding, and advanced packaging are driving the need for more and better measurements.

by Laura Peters

Hybrid Bonding Makes Strides Toward Manufacturability

Companies are selecting preferred flows, but the process details are changing rapidly to meet the needs of different applications.

by Laura Peters

Americas Chip Funding Energizes Industry

Massive government infusions aim to improve security and supply chain robustness.

Startup Funding: Q3 2024

New startups emerge from stealth; 75 companies raise $2 billion.

Knowledge Centers
Entities, people and technologies explored

Related Articles

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

GDDR7 Memory Supercharges AI Inference

High bandwidth and low latency are paramount for AI-powered edge and endpoints.

by Tim Messegee

CPU Performance Bottlenecks Limit Parallel Processing Speedups

Hardware optimizations and well-thought-out software architectures can help, but only incrementally.

by Bryon Moyer

Fantastical Creatures

Why HLS is critical for determining which type of processors to use.

by Russell Klein

Heat-Related Issues Impact Reliability In Advanced IC Designs

Retaining data in memories and processors becomes more difficult as temperatures rise in advanced packages and under heavy workloads.

by Ann Mutschler

Is PPA Relevant Today?

Power, performance, and area/cost have been the three optimization targets for decades, but are they pertinent for today's complex systems?

by Brian Bailey

Power Delivery Challenged By Data Center Architectures

More powerful servers are required to crunch more data, but getting power to those servers is becoming complicated.

by Ann Mutschler

CXL Thriving As Memory Link

Adoption of Compute Express Link protocol spreads as way to connect memories.

by Karen Heyman

About

Navigation

Connect With Us

Facebook
Twitter @semiEngineering
LinkedIn
YouTube

Copyright ©2013-2024 SMG | Terms of Service | Privacy Policy