Startup Funding: December 2023


Photonics and optics were strong in December, with investors funding two different companies using photonic technologies to develop AI chips and interconnects. Another key area — metaoptics — combines what traditionally would be separate lenses and optical components into a single, flat nanopatterned device. Metaoptics are being deployed in applications ranging from AI processing and sensor... » read more

Chip Industry’s Technical Paper Roundup: October 9


New technical papers added to Semiconductor Engineering’s library this week. [table id=153 /] More Reading Technical Paper Library home » read more

Noise Parameter Survey Of Millimeter Wave GaN HEMT Technologies


A technical paper titled “A Survey of GaN HEMT Technologies for Millimeter-Wave Low Noise Applications” was published by researchers at Wright-Patterson AFB, Teledyne Scientific, HRL Laboratories, BAE Systems, Pseudolithic, Northrop Grumman Corporation, and University of California Santa Barbara. "This article presents a set of measured benchmarks for the noise and gain performance of si... » read more

Week In Review: Manufacturing, Test


The Chinese government is considering easing proposed rules that require foreign office equipment makers operating in the country to transfer key product technology to China, per Nikkei Asia. In April 2022, Chinese authorities began revamping their national standards to include a new requirement that key components, such as semiconductors and laser-related items, be designed, developed, and pro... » read more