Advantages Of Picosecond Ultrasonic Technology For Advanced RF Metrology

This paper is from China Semiconductor Technology International Conference (CSTIC). Picosecond Ultrasonics (PULSE Technology) has been widely adopted as the tool-of-record for metal film thickness metrology in semiconductor fabs around the world. It provides unique advantages, such as being a rapid, non-contact, non-destructive technology, and has capabilities for simultaneous multiple layer... » read more

Monitoring Critical Process Steps In 3D NAND Using Picosecond Ultrasonic Metrology With Both Thickness And Sound Velocity Capabilities

Amorphous carbon (a-C) based hard masks provide superior etch selectivity, chemical inertness, are mechanically strong, and have been used for etching deep, high aspect ratio features that conventional photoresists cannot withstand. Picosecond Ultrasonic Technology (PULSE Technology) has been widely used in thin metal film metrology because of its unique advantages, such as being a rapid, non-... » read more

New Twist On Scalable Electronics?

Snug in their tents at Everest base camp a few years ago, Matt Du Puy and his colleagues marveled at the howling snowstorm outside, until they peeked out and saw snow drifts piling up quickly. They made a quick decision to tug on their boots and seek safer ground. As they did, clutches of other campers emerged and fell in line, bleary-eyed refugees trudging through the darkness. “We got of... » read more