tag: Qualcomm

Electric Vehicles Set The Pace
By Gale Morrison - 13 Apr, 2017 - Comments: 0

Electric vehicles are leading the charge for innovation in automotive electronics. Companies that invested and embraced the challenge of EVs are besting their less-nimble, less-open-minded engineering cohorts. Semiconductors and embedded computers have been controlling the dashboard, mirrors, seats, heating and cooling for years. But with EVs, engineering teams are starting to tackle tas... » read more

How Testing MEMS, Sensors Is Different
By Jeff Dorsch - 10 Apr, 2017 - Comments: 2

When it comes to testing microelectromechanical system devices and sensors, sometimes you have to shake and bake. [getkc id="311" comment="MEMS"] and [getkc id="187" kc_name="sensors"] are physically different from standard ICs. They require a specific type of stimulus to get the required testing results. Most chips only need to have an electrical charge run through them to gauge their pass/... » read more

The Week In Review: IoT
By Jeff Dorsch - 07 Apr, 2017 - Comments: 0

Mergers & Acquisitions Qualcomm reported that the waiting period under the Hart-Scott-Rodino Antitrust Improvements Act of 1976 expired on Monday, April 3, clearing the chip design company’s proposed $47 billion acquisition of NXP Semiconductors, at least in the eyes of U.S. antitrust regulators. Qualcomm expects to close the transaction, which will create an Internet of Things powerhouse, b... » read more

Conflicting Goals In Data Centers
By Gale Morrison - 06 Apr, 2017 - Comments: 0

Two conflicting goals are emerging inside of data centers—speed at any cost, and the ability to extend hardware well beyond its expected lifetime to amortize that cost. Layered across both of those are concerns about how to move data back and forth more efficiently, how to secure it, and how to best integrate different generations of technology. But these widely different goals have create... » read more

Challenges Grow For IP Reuse
By Ann Mutschler - 23 Mar, 2017 - Comments: 3

As chip complexity increases, so does the complexity of IP blocks being developed for those designs. That is making it much more difficult to re-use IP from one design to the next, or even to integrate new IP into an SoC. What is changing is the perception that standard [getkc id="43" kc_name="IP"] works the same in every design. Moreover, well-developed [getkc id="100" kc_name="methodologie... » read more

Users Talk Back On Standards Process
By Brian Bailey - 23 Mar, 2017 - Comments: 0

One of the major themes of DVCon this year was the standard that currently goes by the name of Portable Stimulus (see related story, Portable Stimulus – The Name Must Change). It is not ready for prime time yet, but there was plenty to hear and learn about the emerging standard, including what users think about it and the standardization process. The panel gave the users the opportunity to vo... » read more

Big Data On Wheels
By Jeff Dorsch - 02 Mar, 2017 - Comments: 0

By Jeff Dorsch & Ed Sperling All kinds of chips are going into driver-assisted and autonomous cars. On one side are arrays of sensors, which are generating huge amounts of data about everything from lane position and proximity to other cars to unexpected objects in the road. On the other side are the chips required to process that data at blazing speed. As the market for PCs and mobil... » read more

The Week In Review: Design
By Jesse Allen - 17 Feb, 2017 - Comments: 0

Tools Mentor Graphics launched the company's third generation data-center friendly emulation platform, Veloce Strato. The emulator has a capacity of 2.5BG when fully loaded, and total capacity can be increased by linking emulators. It has available slots for 64 Advanced Verification Boards (AVBs) and fully loaded consumes up to 50KW (22.7 W/Mgate) of power. Aldec uncorked the latest versi... » read more

The Week In Review: IoT
By Jeff Dorsch - 10 Feb, 2017 - Comments: 0

Market Research There will be 8.4 billion connected things in use this year, a 31% gain from 2016, and leading up to 20.4 billion connected devices in 2020, according to Gartner. The market research firm estimates worldwide spending on endpoints and services will hit nearly $2 trillion in 2017. Greater China, North America, and Western Europe account for two-thirds of the IoT installed base th... » read more

Betting On Wafer-Level Fan-Outs
By Ed Sperling - 06 Feb, 2017 - Comments: 2

Advanced packaging is starting to gain traction as a commercially viable business model rather than just one more possible option, propelled by the technical difficulties in routing signals at 10nm and 7nm and skyrocketing costs of device scaling on a single die. The inclusion of a [getkc id="202" kc_name="fan-out"] package for logic in Apple's iPhone 7, based on TSMC's Integrated Fan-Out (... » read more

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