The Week In Review: Design/IoT

By Jesse Allen - 17 Apr, 2015 - Comments: 0

Mergers & Acquisitions ARM made two acquisitions related to Bluetooth radio: Wicentric, a Bluetooth Smart stack and profile provider, and Sunrise Micro Devices (SMD), a provider of sub-one volt Bluetooth radio IP. The IP of both companies will be integrated to form ARM's new low-power radio IP portfolio. Numbers EDA revenue grew 11.9% in Q4 2014 to $2.1 billion, a new record for th... » read more

The Week In Review: Design/IoT

By Jesse Allen - 27 Feb, 2015 - Comments: 0

Mergers & Acquisitions NXP acquired Quintic’s Bluetooth Low Energy and Wearable businesses, adding BLTE to their low power RF-connectivity portfolio. The team of approximately 65 is expected to join NXP when the deal closes in Q1 2015. Tools Cadence unveiled the integration of Forte's Cynthesizer with their own C-to-Silicon Compiler. The result is the Stratus high-level synthesis... » read more

The Week In Review: Design

By Ed Sperling - 26 Nov, 2014 - Comments: 0

M&A NXP Semiconductors acquired the IP assets of Quintic for its wearable and Bluetooth Low Energy business. The deal is aimed at IoT applications. Numbers Mentor Graphics' numbers hit a record in fiscal Q3, which ended on Oct. 31. Revenue was $292.7 million, up from $275.6 million in the same period in 2013. Non-GAAP earnings were $39.92 million, up from $37.29 million in the same per... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Quintic

The Week In Review: Design/IoT

The Week In Review: Design/IoT

The Week In Review: Design