Week in Review: IoT, Security, Auto

By Jeff Dorsch - 19 Apr, 2019 - Comments: 0

Internet of Things Combining artificial intelligence with unmanned aerial vehicles could provide a quicker and safer alternative to inspecting roadways for cracks, potholes, and other damage, according to a paper posted on arvix.org. “[M]anual visual inspection [is] not only tedious, time-consuming, and costly, but also dangerous for the personnel. Furthermore, the detection results are alwa... » read more

The Week in Review: IoT

By Jeff Dorsch - 01 Dec, 2017 - Comments: 0

Products/Services At this week’s AWS re:Invent conference in Las Vegas, Nevada, Amazon Web Services introduced a number of products and services for the Internet of Things, machine learning, and other areas. These include Amazon FreeRTOS (an operating system for IoT microcontrollers), AWS IoT Device Defender (security management), AWS IoT 1-Click, AWS IoT Device Management, AWS IoT Analytics... » read more

Blurring The Lines At The OS Level

By Ed Sperling - 13 Sep, 2012 - Comments: 0

By Ed Sperling Picking an operating system—or choosing not to use an operating system—is becoming as complex a decision as choosing which IP to use in an SoC. Even decisions that sound straightforward may have ramifications on the total system power budget or performance, requiring them to be an integral part of the overall architectural process. But the choice of operating systems, as ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: real-time operating systems

Week in Review: IoT, Security, Auto

The Week in Review: IoT

Blurring The Lines At The OS Level