Advanced Packaging Fundamentals for Semiconductor Engineers
New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.
Chip Industry Week in Review
TSMC's technology roadmap; Intel cuts; reciprocal hacking; McKinsey on IC challenges, ML algorithm table; subsystem chiplets; cross-domain PLM; magnetic switches; sarin sensors.
Three-Way Race To 3D-ICs
Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.
Chip Industry Week in Review
AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.
AI Agents Need Goals
AI cannot optimize unless it can measure progress towards goals, but defining those goals is not easy, especially when looking at the entire development flow.
Global IC Fabs And Facilities Report: 2024
Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form hubs with friendly nations.
EUV’s Future Looks Even Brighter
Demand for AI chips is growing exponentially, but costs and complexity limit the technology to a handful of companies. That could soon change.
Linear Pluggable Optics Save Energy In Data Centers
New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.
Chip Architectures Becoming Much More Complex With Chiplets
Options for how to build systems increase, but so do integration issues.
Startup Funding: Q1 2025
AI chips and data center communications see big funding; 75 startups raise $2 billion.
Advanced Packaging Fundamentals for Semiconductor Engineers
New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.
