WLFO For High-Performance Low-Cost Packaging Of RFMEMS-CMOS

By Amkor - 17 Feb, 2021 - Comments: 0

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of micro-electromechanical systems (MEMS), either monolithic or heterogeneous, introduces yet another level of complexity that has only recently been a major focus of multi-device packaging. Wafer-level fanout (W... » read more

RF Device And Process Biz Heats Up

By Mark LaPedus - 26 Apr, 2017 - Comments: 0

The RF device and process technology markets are heating up, especially for two critical components used in smartphones—RF switch devices and antenna tuners. RF device makers and their foundry partners continue to ramp up traditional RF switch chips and tuners based on RF SOI process technologies for today’s 4G wireless networks. And recently, [getentity id="22819" comment="GlobalFoundri... » read more

Making Phones Better

By Mattan Kamon - 18 Aug, 2016 - Comments: 0

Beneath a smartphone's slick packaging is some interesting, highly sophisticated technology that makes the user experience what it is today. Much of that experience relies on satisfying our ever growing desire for more data capacity for video, social media and the like. Providing that capacity relies on robust filtering to receive just your data stream amongst many nearby other streams. But tha... » read more

Knowledge Centers
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tag: RF-MEMS

WLFO For High-Performance Low-Cost Packaging Of RFMEMS-CMOS

RF Device And Process Biz Heats Up

Making Phones Better