2023 Open Source Security And Risk Analysis Report

By Synopsys - 01 Nov, 2023 - Comments: 0

The annual “Open Source Security and Risk Analysis” (OSSRA) report, now in its 8th edition, examines vulnerabilities and license conflicts found in roughly 1,700 codebases across 17 industries. The report offers recommendations for security, legal, risk, and development teams to better understand the security and risk landscape accompanying open source development and use. Click here to ... » read more

Software Due Diligence: A Buyer’s Checklist And Guidelines

By Synopsys - 02 Dec, 2020 - Comments: 0

The potential risk and exposure posed by M&A transactions demand thorough and robust due diligence practices. When an acquisition involves software, it's critical to ensure that associated risks are identified and fully understood. Knowing what questions to ask when performing due diligence is key to avoiding potential risks and legal complications. This is especially true for the acquisiti... » read more

Rethinking Car Design

By Ann Mutschler - 06 Jul, 2017 - Comments: 0

The automotive industry is undergoing sweeping changes in both technology and business, and functional safety increasingly cuts across both of them. Every safety-critical industry has one or more functional safety standards, whether that is manufacturing, avionics or automotive. In automotive, it's a combination of [gettech id="31076" comment="ISO 26262"] and various ASIL levels, which are a... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: risk analysis

2023 Open Source Security And Risk Analysis Report

Software Due Diligence: A Buyer’s Checklist And Guidelines

Rethinking Car Design