Americas Chip Funding Energizes Industry

By Liz Allan - 23 Oct, 2024 - Comments: 0

This is the second in a series of articles tracking government chip investments. See part one here (global), part 3 covering EMEA is here and Asia here. Since the first announcement of a non-binding preliminary memorandum of terms with BAE Systems in December 2023, the U.S. Department of Commerce has rolled out comprehensive plans to support more than a dozen companies in order to shore up... » read more

Why Small Fab And Assembly Houses Are Thriving

By Bryon Moyer - 15 Aug, 2024 - Comments: 0

High-volume products get more than their fair share of attention in the semiconductor world, but most chips don't fit into that category. While a few huge fabs and offshore assembly and test (OSAT) houses process enormous volumes of chips, small fabs and packaging lines serve for lower volumes, specialized technology, and prototyping. “There are companies that run literally one lot of 25 w... » read more

Chip Industry Week In Review

By The SE Staff - 03 Jul, 2024 - Comments: 0

Early version due to U.S. holiday. The U.S. government announced a new $504 million funding round for 12 Regional Technology and Innovation Hubs (Tech Hubs) for semiconductors, clean energy, biotechnology, AI, quantum computing, and more. Among the recipients: NY SMART I-Corridor Tech Hub (New York): $40 million for semiconductor manufacturing; Headwaters Hub (Montana): $41 million f... » read more

Money Pours Into New Fabs And Facilities

By Liz Allan - 03 Jan, 2024 - Comments: 0

Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

200mm Shortages May Persist For Years

By Mark LaPedus - 20 Jan, 2022 - Comments: 2

A surge in demand for chips at more mature process nodes is causing shortages for both 200mm foundry capacity and 200mm equipment, and it shows no signs of letting up. In fact, even with new capacity coming on line this year, shortages are likely to persist for years, driving up prices and forcing significant changes across the semiconductor supply chain. Shortages for both 200mm foundry cap... » read more

Rogue Valley Microdevices: MEMS Foundry

By Ed Sperling - 13 Mar, 2019 - Comments: 0

Venturing into the MEMS manufacturing market is a shaky proposition. The investment is high, the returns are questionable, and the competition can be fierce. Rogue Valley Microdevices is one of a handful of pure-play MEMS foundries in the United States, a difficult market divided into two distinct parts. One on side are a handful of higher-margin new technologies, such as piezoelectric micro... » read more

What’s Up With MEMS?

By Paula Doe - 19 Oct, 2017 - Comments: 0

New sensor technologies, and smarter ways of integrating more intelligence, continue to generate unexpected opportunities in the changing MEMS business. Changes needed for sensors for context awareness If digital assistants are ever going to be really useful, they’ll need some particular sensor capabilities to understand emotion, suggests Lama Nachman, head of Intel’s Anticipatory Compu... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Rogue Valley Microdevices

Americas Chip Funding Energizes Industry

Why Small Fab And Assembly Houses Are Thriving

Chip Industry Week In Review

Money Pours Into New Fabs And Facilities

200mm Shortages May Persist For Years

Rogue Valley Microdevices: MEMS Foundry

What’s Up With MEMS?