tag: Samsung

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Jun, 2020 - Comments: 0

Chipmakers Jim Keller, senior vice president in the Technology, Systems Architecture and Client Group (TSCG) and general manager of the Silicon Engineering Group (SEG) at Intel, has resigned amid a major reorganization at the company. Here's one report about the situation. Cree as well as China’s Yutong Group and StarPower are working together to accelerate the commercial adoption of sili... » read more

Aging Problems At 5nm And Below
By Brian Bailey - 11 Jun, 2020 - Comments: 3

The mechanisms that cause aging in semiconductors have been known for a long time, but the concept did not concern most people because the expected lifetime of parts was far longer than their intended deployment in the field. In a short period of time, all of that has changed. As device geometries have become smaller, the issue has become more significant. At 5nm, it becomes an essential par... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 05 Jun, 2020 - Comments: 0

Materials A major setback has been dealt to the United States’ efforts to develop rare earths. The U.S. is attempting to develop its own supply of rare earths, hoping to reduce its reliance on China. China controls nearly 90% of the world’s rare earths, which are used in magnets and various electronic systems. In April, the U.S. Department of Defense (DoD) awarded two U.S.-based firms, Lyn... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 May, 2020 - Comments: 0

Chipmakers and OEMs Senator Patrick Leahy (D-Vt.), Senator Chuck Schumer (D-N.Y.) and Senator Jack Reed (D-R.I.) have sent a letter to officials from the Trump administration, demanding answers about TSMC’s recent announcement to build a fab in Ariz. As reported, TSMC has announced its intention to build and operate an advanced semiconductor fab in the U.S. The fab, to be built in Arizona, w... » read more

EUV’s Uncertain Future At 3nm And Below
By Mark LaPedus - 21 May, 2020 - Comments: 5

Several foundries have moved extreme ultraviolet (EUV) lithography into production at both 7nm and 5nm, but now the industry is preparing for the next phase of the technology at 3nm and beyond. In R&D, the industry is developing new EUV scanners, masks and resists for the next nodes. 3nm is slated for 2022, followed by 2nm a year or two later. Nonetheless, it will require massive funding... » read more

‘More Than Moore’ Reality Check
By Ann Mutschler - 14 May, 2020 - Comments: 1

The semiconductor industry is embracing multi-die packages as feature scaling hits the limits of physics, but how to get there with the least amount of pain and at the lowest cost is a work in progress. Gaps remain in tooling and methodologies, interconnect standards are still being developed, and there are so many implementations of packaging that the number of choices is often overwhelming. ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 May, 2020 - Comments: 0

Chipmakers The Trump administration has held talks with Intel and TSMC to build more leading-edge fabs in the U.S., according to the Wall Street Journal and other news outlets. IC Insights has released its rankings of the top-10 chip vendors in terms of sales for the first quarter. Intel remains in first place, followed by Samsung and TSMC. The big surprise is China-based fabless IC supplie... » read more

Startup Funding: April 2020
By Jesse Allen - 06 May, 2020 - Comments: 0

It was another strong month for automotive startups, with one autonomous trucking company in China drawing a massive $100M investment. Another hot area was optimization of machine learning deployments, including one new company launch. Quantum computing, etch equipment, and mmWave feature in this month's look at twenty-two startups that collectively raised $375M. Semiconductors & design ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 May, 2020 - Comments: 0

Fab tools The U.S. Department of Commerce has announced new export control actions to prevent China, Russia, and Venezuela from obtaining U.S. technology for military purposes. This expands the “Military End Use/User Controls (MEU)” license requirement controls on China, Russia, and Venezuela, covering military end-users, as well as semiconductor equipment, sensors and other technologies. ... » read more

Manufacturing Bits: April 28
By Mark LaPedus - 28 Apr, 2020 - Comments: 1

Gate-all-around reliability The 2020 IEEE International Reliability Physics Symposium (IRPS) will kick off this week, this time as a virtual event. IRPS is a conference that focuses on the latest research in microelectronics reliability. The event starts off with keynotes from Infineon, Intel and Texas Instruments. IRPS also involves a multitude of papers and presentations. On the logi... » read more

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