tag: Samsung

Week In Review: Manufacturing, Test
By Mark LaPedus - 31 May, 2019 - Comments: 0

Trade wars The trade war between the United States and China is escalating and it is here to stay. Victor Davis Hanson, a senior fellow at think tank Hoover Institution, said the United States is at a crossroads with China. It could define America’s security and the international order for decades to come. Here’s the latest blog on trade tensions between the U.S. and China. “Tensions ... » read more

MicroLEDs: The Next Revolution In Displays?
By Mark LaPedus - 29 May, 2019 - Comments: 1

Flat-panel display technology is exploding on several fronts as more screens are required for more devices. But one type of display is generating an enormous amount of buzz in the market—microLEDs. Dozens of companies are working on micro-light emitting diodes (microLEDs), a technology that promises to provide better and brighter displays than current solutions in the market. Apple, Facebo... » read more

3D NAND Race Faces Huge Tech And Cost Challenges
By Mark LaPedus - 23 May, 2019 - Comments: 8

Amid the ongoing memory downturn, 3D NAND suppliers continue to race each other to the next technology generations with several challenges and a possible shakeout ahead. Micron, Samsung, SK Hynix and the Toshiba-Western Digital duo are developing 3D NAND products at the next nodes on the roadmap, but the status of two others, Intel and China’s Yangtze Memory Technologies Co. (YMTC), is les... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 17 May, 2019 - Comments: 0

Market research In terms of overall IC sales, Intel has replaced Samsung as the number one quarterly semiconductor supplier in 4Q18 after losing the lead spot to Samsung in 2Q17, according to IC Insights. “While Samsung held the full-year number one ranking in 2017 and 2018, Intel is forecast to easily recapture the number one ranking for the full-year of 2019, a position it previously held ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 10 May, 2019 - Comments: 0

Trade More trade news: "The Trump administration is hiking duties on $200 billion worth of Chinese products to 25% from 10%," according to CNBC. The following is attributed to Gary Shapiro, president and CEO of the Consumer Technology Association (CTA), in response to President Trump’s plan to increase tariffs on $200 billion worth of Chinese imports to 25%: “The president is seeking a bet... » read more

Challenges In Making And Testing STT-MRAM
By Mark LaPedus - 07 May, 2019 - Comments: 1

Several chipmakers are ramping up a next-generation memory type called STT-MRAM, but there are still an assortment of manufacturing and test challenges for current and future devices. STT-MRAM, or spin-transfer torque MRAM, is attractive and gaining steam because it combines the attributes of several conventional memory types in a single device. In the works for years, STT-MRAM features the ... » read more

5G Heats Up Base Stations
By Kevin Fogarty - 07 May, 2019 - Comments: 4

Before 5G can be deployed commercially on a large scale, engineers have to solve some stubborn problems—including how to make a hot technology a whole lot cooler. 5G-capable modem chipsets are already on the market from Qualcomm, Samsung, Huawei, MediaTek, Intel and Apple, with some 5G service (LTE-Advanced/LTE-Advanced Pro) available in the U.S. But still mostly missing from the 5G equati... » read more

Creating A Roadmap For Hardware Security
By Kevin Fogarty and Ed Sperling - 02 May, 2019 - Comments: 0

The U.S. Department of Defense and private industry consortiums are developing comprehensive and cohesive cybersecurity plans that will serve as blueprints for military, industrial and commercial systems. What is particularly noteworthy in all of these efforts is the focus on semiconductors. While software can be patched, vulnerabilities such as Spectre, Meltdown and Foreshadow need to be de... » read more

Focus Shifting From 2.5D To Fan-Outs For Lower Cost
By Ed Sperling - 29 Apr, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with Calvin Cheung, vice president of engineering at ASE; Walter Ng, vice president of business management at UMC; Ajay Lalwani, vice president of global manufacturing operations at eSilicon; Vic Kulkarni, vice president and chief strategist in the office of the CTO at ANSYS; and Tien Shiah, senior manager for memory at Samsung. W... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 26 Apr, 2019 - Comments: 0

Fab tools and test Lam Research has developed a new self-maintaining or self-cleaning chamber for its etch tools. With the technology, Lam announced a new industry benchmark has been set for productivity in etch processing using its self-maintaining equipment. Etch process modules are typically cleaned weekly or monthly. Recently, Lam and a chipmaker reached the milestone of going 365 days... » read more

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