tag: Samsung

2.5D Surprises And Alternatives
By Ed Sperling - 20 Oct, 2016 - Comments: 0

Semiconductor Engineering sat to discuss advanced packaging issues with Juan Rey, senior director of engineering for Calibre at [getentity id="22017" e_name="Mentor Graphics"]; Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; and Lisa Minwell, [getentity id="22242" e_name="eSilicon's"] senior director of IP marketing. What follows are excerpts of that conversation. ... » read more

10nm FinFET Market Heats Up
By Mark LaPedus - 16 Oct, 2016 - Comments: 1

The 10nm finFET market is heating up in the foundry business amid the ongoing push to develop chips at advanced nodes. Not long ago, Intel announced its 10nm finFET process, with plans to ramp up the technology in 2017. Then, TSMC recently introduced its 10nm process, with plans to move into production by the fourth quarter of 2016. Now, Samsung Electronics said that it has commenced mass... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 14 Oct, 2016 - Comments: 0

Chipmakers Alain Kaloyeros, president of SUNY Polytechnic Institute, has resigned. This comes amid charges that Kaloyeros was involved in an alleged bid-rigging scheme, according to multiple reports. SUNY Poly, a high-tech educational ecosystem in New York, was recently formed from the merger of the SUNY College of Nanoscale Science and Engineering (CNSE) and the SUNY Institute of Technology. ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 07 Oct, 2016 - Comments: 0

Fab tools and materials After a series of delays due to regulatory issues, Lam Research and KLA-Tencor have agreed to terminate their proposed merger agreement. Amid a possible proxy battle, Kulicke & Soffa Industries has named Fusen Chen as president and chief executive, effective Oct. 31. He was also elected to the board of K&S. Jonathan Chou, chief financial officer and interim CEO, w... » read more

The Looming AI War
By Ed Sperling - 06 Oct, 2016 - Comments: 0

A recent spate of acquisitions and announcements in AI and machine learning is setting the stage for a colossal showdown across the tech industry. Among those vying for top spots are Samsung, Google, Apple, Microsoft and Amazon, each with a large enough revenue stream to support an M&A feeding frenzy and the sustained investments required to remain competitive. Consider the most recent a... » read more

Neural Net Computing Explodes
By Gale Morrison - 06 Oct, 2016 - Comments: 1

Neural networking with advanced parallel processing is beginning to take root in a number of markets ranging from predicting earthquakes and hurricanes to parsing MRI image datasets in order to identify and classify tumors. As this approach gets implemented in more places, it is being customized and parsed in ways that many experts never envisioned. And it is driving new research into how el... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 30 Sep, 2016 - Comments: 0

Chipmakers In 2016, growth in the pure-play foundry business will be driven by leading-edge processes, according to IC Insights. In fact, the increase in pure-play foundry sales this year is forecast to be almost entirely due to processes at » read more

Smartphone Security: For Your Eyes Only
By Adrienne Downey - 26 Sep, 2016 - Comments: 0

Fans of the Olympics here in the United States were treated to a great Samsung commercial throughout the broadcast. The commercial stars the genius, multi-award-winning actor Christoph Waltz, showing how Americans can multitask with the amazing new Galaxy Note7. Yes, THAT Galaxy Note7. The 90-second long commercial is a delight to watch, but it must have cost Samsung some serious bucks to produ... » read more

Packaging Wars Begin
By Mark LaPedus - 26 Sep, 2016 - Comments: 1

The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] technologies, high-density fan-out packages and others. At one time, the outsourced semiconductor assembly and test ([getkc id="83" comment="OSAT"]) vendors dominated and handled the chip-packaging requirement... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 23 Sep, 2016 - Comments: 0

Fab tools and T&M Applied Materials and the Institute of Microelectronics (IME), a research institute under the Agency for Science, Technology and Research (A*STAR), have announced a five-year extension of their R&D collaboration at the Centre of Excellence in Advanced Packaging in Singapore. The organizations will expand the scope of their R&D collaboration to focus on advancing fan-out wafer... » read more

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