Manufacturing Bits: Sept. 29

By Mark LaPedus - 29 Sep, 2020 - Comments: 0

Exploring chemical reactions using EUV The University of Tokyo has established a facility to study fast chemical reactions using a coherent extreme ultraviolet light source. The new coherent extreme ultraviolet (XUV) source facility enables researchers to explore time-dependent phenomena, such as ultrafast chemical reactions of biological or physical samples. Located in an underground fa... » read more

System Bits: July 10

By Jeff Dorsch - 10 Jul, 2019 - Comments: 0

Light waves run on silicon-based chips Researchers at the University of Sydney’s Nano Institute and Singapore University of Technology and Design collaborated on manipulating light waves on silicon-based microchips to keep coherent data as it travels thousands of miles on fiber-optic cables. Such waves—whether a tsunami or a photonic packet of information—are known as solitons. The... » read more

Manufacturing Bits: July 3

By Mark LaPedus - 03 Jul, 2019 - Comments: 0

Gamma-ray inspection The Defense Advanced Research Projects Agency (DARPA) has started a program to develop gamma-ray inspection techniques. The effort, called the Gamma Ray Inspection Technology (GRIT) program, is aimed to develop gamma-ray radiation sources in compact form factors for use in national security, industrial, and medical applications. [caption id="attachment_24151285" alig... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 28 Jun, 2019 - Comments: 0

Products/Services Visa agreed to acquire the token and electronic ticketing business of Rambus for $75 million in cash. The business involved is part of the Smart Card Software subsidiary of Rambus. It includes the former Bell ID mobile-payment businesses and the Ecebs smart-ticketing systems for transit providers. Meanwhile, Rambus expanded its CryptoManager Root of Trust product line. “Sec... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: San Diego Supercomputer Center

Manufacturing Bits: Sept. 29

System Bits: July 10

Manufacturing Bits: July 3

Week in Review: IoT, Security, Auto

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Knowledge Centers
Entities, people and technologies explored