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Week In Review: Manufacturing, Test


Chipmakers United Microelectronics Corp. (UMC) has satisfied all closing conditions for the full acquisition of Mie Fujitsu Semiconductor Ltd. (MIFS), the former 300mm wafer foundry joint venture between UMC and Fujitsu Semiconductor Ltd. (FSL). The completion of the acquisition is scheduled for Oct. 1. In 2014, FSL and UMC agreed for UMC to acquire a 15.9% stake in MIFS from FSL through pr... » read more

Making Chip Packaging Simpler


Packaging is emerging as one of the most critical elements in semiconductor design, but it's also proving difficult to master both technically and economically. The original role of packaging was simply to protect the chips inside, and there are still packages that do just that. But at advanced nodes, and with the integration of heterogeneous components built using different manufacturing pr... » read more

Week In Review: Manufacturing, Test


Chipmakers A U.S. federal grand jury has indicted Chinese DRAM maker Jinhua Integrated Circuit Co. (JHICC), Taiwan's UMC and three individuals, charging them with alleged crimes related to a conspiracy to steal, convey, and possess stolen trade secrets from Micron Technology for the benefit of a company controlled by the China government. In addition, the U.S. filed a civil lawsuit seeking... » read more