Chips, Business And The Coronavirus

By Ed Sperling - 30 Jan, 2020 - Comments: 2

In the spring of 2003, the SARS (severe acute respiratory syndrome) hit China and Hong Kong, creating such panic that no one would touch crates on shipping docks. Ultimately, it erased an estimated $40 billion from the global economy and effectively shut down the Chinese semiconductor industry for several months. It could have been much worse, though, and this is what is particularly troubli... » read more

Living On The Edge

By Ed Sperling - 17 Apr, 2014 - Comments: 0

Looking around the globe at the big foundries these days, many of them are in danger zones—geopolitical, seismological, or areas that have been the incubators for public health disasters in recent years. This is one of the risks of a global supply chain, and it’s one that should cause ulcers for any supply chain management executive. South Korea’s Samsung is within a short missile laun... » read more

What’s The Backup Plan?

By Ed Sperling - 23 Jan, 2014 - Comments: 0

Over the past dozen years we have witnessed two major breakdowns in the global semiconductor supply chain. The first occurred in 2002, when an outbreak of severe acute respiratory syndrome (SARS) basically closed off Chinese manufacturing for several months. The second major problem occurred in 2011, when the Tohoku earthquake and a devastating tsunami shut down a good portion of Japanese produ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: SARS

Chips, Business And The Coronavirus

Living On The Edge

What’s The Backup Plan?