Manufacturing Bits: Jan. 25

By Mark LaPedus - 25 Jan, 2022 - Comments: 0

Stretchable thermometers The Harvard John A. Paulson School of Engineering and Applied Sciences (SEAS) has developed a stretchable and self-powered thermometer that can be integrated into various systems, such as stretchable electronics and soft robots. Depending on the materials used, the stretchable thermometer can measure temperatures of more than 200 degrees Celsius to -100 degrees Cel... » read more

Power/Performance Bits: March 4

By Ann Mutschler - 04 Mar, 2014 - Comments: 0

Photon glue Like a spring connecting two swings, light can act as photon glue that binds together the quantum mechanical properties of two vastly different materials and this effect could harness the most useful characteristics from each material for hybrid solar cells and high efficiency lighting, among other applications. To this end, researchers at the University of Michigan and Queens Coll... » read more

Power/Performance Bits: Nov. 5

By Brian Bailey - 05 Nov, 2013 - Comments: 0

Even the world's best supercomputers are staggeringly inefficient and energy-intensive machines. Our brains have upwards of 86 billion neurons, connected by synapses that not only complete myriad logic circuits, but continuously adapt to stimuli, strengthening some connections while weakening others. We call that process learning, and it enables the kind of rapid, highly efficient computational... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: SEAS

Manufacturing Bits: Jan. 25

Power/Performance Bits: March 4

Power/Performance Bits: Nov. 5

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