tag: SEMI

Blog Review: Mar. 19
By Jesse Allen - 19 Mar, 2025 - Comments: 0

Cadence's Neelabh Singh explains the defined port operations of USB4 that are used to bring transmitters burst and receivers of a design under test into compliance mode and to execute tests like bit error tests, error rate tests, clock switch tests, TxFFE equalization tests, and electrical idle tests. Siemens EDA's Stephen V. Chavez examines the use of blind and buried vias in high-density i... » read more

Blog Review: Mar. 12
By Jesse Allen - 12 Mar, 2025 - Comments: 0

Cadence's P. Saisrinivas explains the relationship between drive strength and cell delay and why it is key to choose the appropriate drive strength to meet timing constraints while minimizing power and area. Siemens' Daniel Berger and Dirk Hartmann tackle the readout problem of accurately measuring the state of a quantum system after it has undergone a quantum computation, which becomes incr... » read more

Chip Industry Week In Review
By The SE Staff - 07 Mar, 2025 - Comments: 0

The Malaysian government signed a deal with Arm to kickstart a chip design ecosystem. Until now, Malaysia has focused on packaging and test. Adding chip design represents a major change in focus. The country will pay SoftBank $250 million over 10 years for Arm’s chip design IP and train 10,000 engineers. Global chip sales reached $56 billion in January, up nearly 18% from the same period i... » read more

Chip Industry Week In Review
By The SE Staff - 28 Feb, 2025 - Comments: 0

Intel said its new fab in Licking County, Ohio will be delayed due to financial struggles and a need to align chip production with market demand, reported the Columbus Dispatch. Construction is now estimated to be completed in 2030, with operations to start in 2030 or 2031. The company said it already has invested $3.7 billion locally. Apple plans to invest more than $500 billion in the U.S... » read more

Developing Systems For Heterogeneous Integration: Insights From HiCONNECTS
By Kartikey Srivistava - 20 Feb, 2025 - Comments: 0

The European semiconductor ecosystem continues to evolve, driven by the ambitions outlined in the EU Chips Act. With goals to strengthen Europe’s technological leadership and double its semiconductor manufacturing market share to 20% by 2030, collaboration across the value chain is imperative. Heterogeneous Integration for Connectivity and Sustainability (HiCONNECTS), a Horizon Europe-funde... » read more

Blog Review: Feb. 19
By Jesse Allen - 19 Feb, 2025 - Comments: 0

Cadence's Ravi Vora explains the AMBA Local Translation Interface protocol, which defines the point-to-point protocol between an I/O device and the Translation Buffer Unit of an Arm System Memory Management Unit. Siemens' Stephen V. Chavez provides a checklist for ensuring the quality and functionality of a PCB at every stage, from design through fabrication, assembly, and testing, with a fo... » read more

Chip Industry Week In Review
By The SE Staff - 14 Feb, 2025 - Comments: 0

Worldwide silicon wafer shipments declined nearly 2.7% to 12,266 million square inches in 2024, with wafer revenue contracting 6.5% to $11.5 billion, according to the SEMI Silicon Manufacturers Group. CSIS released a new report, “Critical Minerals and the Future of the U.S. Economy,” with detailed analysis and policy recommendations for building a secure mineral supply chain for semicond... » read more

IC Equipment Communication Standards Struggle As Data Volumes Grow
By Anne Meixner - 11 Feb, 2025 - Comments: 0

The tsunami of data produced during wafer fabrication cannot be effectively leveraged without standards. They determine how data is accessed from equipment, which users need data access and when, and how fast it can be delivered. On top of that, best practices in data governance and data quality are needed to effectively interpret collected data and transfer results. When fab automation and ... » read more

Blog Review: Feb. 5
By Jesse Allen - 05 Feb, 2025 - Comments: 0

Cadence's Rajneesh Chauhan explores the extended metadata feature in CXL 3.1, which helps systems manage memory and devices more effectively by sending extra information along with memory transactions to provide more context about what's happening during these transactions. Siemens' Bianca Ward recommends semiconductor companies combat rising production costs by leaning into digitalization a... » read more

Blog Review: Jan. 29
By Jesse Allen - 29 Jan, 2025 - Comments: 0

Cadence's Reela Samuel looks beyond silicon to new semiconductor materials under development and the particular applications for gallium nitride, silicon carbide, indium phosphide, glass, and diamond. Siemens' Kyle Fraunfelter and Melville Bryant find that lean approaches alone cannot address the increasingly complex sustainability challenges of semiconductor manufacturing and call for the e... » read more

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