tag: SEMI

Chip Industry Week In Review
By The SE Staff - 13 Sep, 2024 - Comments: 0

Infineon rolled out the world's first 300mm gallium nitride (GaN) wafer, opening the door for high-volume manufacturing of GaN-based power semiconductors. A 300mm wafer contains 2.3 times as many chips per wafer as a 200mm wafer. Fig.1: Infineon's 300mm GaN wafer. Source: Infineon The Semiconductor Industry Association released its 2024 State of the U.S. Semiconductor Industry report th... » read more

Blog Review: Sept. 11
By Jesse Allen - 11 Sep, 2024 - Comments: 0

Cadence's Neha Joshi introduces the IEEE 1801 standard, also known as UPF (Unified Power Format), which offers a uniform framework for defining power domains, power states, and power intent to ensure consistency across diverse tools and phases of the design process. Siemens' John McMillan warns that known good die may not behave the same in 3D-ICs as they do standalone and suggests that mult... » read more

Chip Industry Week In Review
By The SE Staff - 06 Sep, 2024 - Comments: 0

Concerns mount on the use of American-manufactured semiconductors in Russian weapons, with Analog Devices, AMD, Intel and TI set to testify next week before the U.S. Senate Permanent Subcommittee on Investigations. Also, U.S. and other government agencies issued a joint advisory and more details about ongoing Russian military cyberattacks, espionage, and sabotage. The U.S. Commerce Departmen... » read more

Blog Review: Sept. 4
By Jesse Allen - 04 Sep, 2024 - Comments: 0

Synopsys' Jyotika Athavale and Randy Fish sit down with Google's Rama Govindaraju and Microsoft's Robert S. Chappell to discuss silent data corruption and why a solution will require chip designers and manufacturers, software and hardware engineers, vendors, and anyone involved in computer data to collaborate and take the issue seriously. Siemens' Karen Chow and Joel Mercier explain the rela... » read more

Blog Review: Aug. 28
By Jesse Allen - 28 Aug, 2024 - Comments: 0

Synopsys' Jon Ames checks out how the Ultra Ethernet Consortium aims to revolutionize networking by optimizing Ethernet for the rapidly evolving AI and HPC workloads by addressing critical issues like tail latency that are encountered by machine learning algorithms in large compute clusters. Cadence's Kos Gitchev introduces the DDR5 Multiplexed Rank DIMM (MRDIMM), a memory module technology ... » read more

Chip Industry Week In Review
By The SE Staff - 23 Aug, 2024 - Comments: 0

Chinese firms imported almost $26 billion worth of chipmaking machinery, according to fresh trade data released by China’s General Administration of Customs this week, Bloomberg reports. Meanwhile, the global semiconductor manufacturing industry continued to show signs of improvement in Q2 2024 with significant growth of IC sales, stabilizing capital expenditure, and an increase in install... » read more

Blog Review: Aug. 21
By Jesse Allen - 21 Aug, 2024 - Comments: 0

Cadence's Reela Samuel explores the critical role of PCIe 6.0 equalization in maintaining signal integrity and solutions to mitigate verification challenges, such as creating checkers to verify all symbols of TS0, ensuring the correct functioning of scrambling, and monitoring phase and LTSSM state transitions. Siemens' John McMillan introduces an advanced packaging flow for Intel's Embedded ... » read more

Building Smarter, Better Fabs
By Laura Peters - 15 Aug, 2024 - Comments: 0

Battling labor shortages, faster ramp rates, and data overload, the process of designing and building greenfield fabs requires a combination of tech tools, failing earlier approaches and superior planning from day one. The complexity and scale of semiconductor fabs is skyrocketing as is the capital cost. Chipmakers are looking to ramp multibillion dollar fabs faster despite the hurdles of la... » read more

Why Small Fab And Assembly Houses Are Thriving
By Bryon Moyer - 15 Aug, 2024 - Comments: 0

High-volume products get more than their fair share of attention in the semiconductor world, but most chips don't fit into that category. While a few huge fabs and offshore assembly and test (OSAT) houses process enormous volumes of chips, small fabs and packaging lines serve for lower volumes, specialized technology, and prototyping. “There are companies that run literally one lot of 25 w... » read more

Securing Supply Chains At SEMICON West 2024
By John Cooney - 15 Aug, 2024 - Comments: 0

Jose Fernandez, U.S. Under Secretary of State for Economic Growth, Energy, and the Environment, sat down with Joe Stockunas, President of SEMI Americas, for a fireside chat on the CEO Summit keynote stage at SEMICON West 2024. In the Securing Critical Supply Chains for the 21st Century discussion, Fernandez emphasized the need to form partnerships to address vulnerabilities as the key to cre... » read more

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