A Different Foundry Model

By Joanne Itow - 17 Oct, 2019 - Comments: 0

As the pursuit to produce advanced semiconductors that keep up with the Moore’s Law treadmill becomes more and more challenging, many companies are seeking other ways to provide the next ‘must-have’ electronic products. In fact, many companies have realized that the need for doubling performance is no longer the main attribute necessary to deliver successful solutions for IoT, automotive,... » read more

ML, Edge Drive IP To Outperform Broader Chip Market

By Kevin Fogarty - 03 Oct, 2019 - Comments: 0

The market for third-party semiconductor IP is surging, spurred by the need for more specific capabilities across a wide variety of markets. While the IP industry is not immune to steep market declines in semiconductor industry, it does have more built-in resilience than other parts of the industry. Case in point: The top 15 semiconductor suppliers were hit with an 18% decline in 2019 first-... » read more

Scaling Battery Technology

By Jim Feldhan - 23 Sep, 2019 - Comments: 0

Batteries are an essential ingredient for the growth of electronics from small devices used for IoT as well as large batteries for electric cars. Historically, battery energy density improves 5%-8% per year. While this is much slower than the historical improvements from Moore’s Law, it’s still the kind of growth that can result in leaps in efficiency, opening the door for a better experien... » read more

Recent Earthquakes Highlight Risk To Semiconductor Manufacturing Sites

By Adrienne Downey - 24 Jul, 2019 - Comments: 0

On July 4, 2019, southern California experienced a 6.4 magnitude earthquake followed by a 7.1 earthquake the next day. Both earthquakes occurred near the town of Ridgecrest, but they were not related to the San Andreas fault, an 800-mile fault zone in California where two tectonic plates meet. The San Andreas fault is generally considered to be where “the big one” could occur in California,... » read more

Falling Chip Forecasts

By Mark LaPedus - 20 Jun, 2019 - Comments: 1

It’s time to take a pulse of the semiconductor market amid the memory downturn and trade frictions with China. For some time, the DRAM and NAND markets have been hit hard with falling prices and oversupply. Then, the Trump administration last year slapped tariffs on Chinese goods. China retaliated. And the trade war rages on between the U.S. and China. More recently, the U.S. Department... » read more

Automotive Semiconductors Boost MCU, Analog Markets

By Jim Feldhan - 20 Jun, 2019 - Comments: 0

Auto sales are expected to experience a slowdown in 2019, and even with the continued increase in electronics per vehicle, automotive semiconductor sales are also expected to experience a slowdown. Similar to prior years, 2019/2020 car models will include more automotive semiconductor devices to provide higher degrees of safety, comfort and convenience, driver assist capabilities, in-cabin ente... » read more

Impact Of U.S.-China Trade War

By Mark LaPedus - 23 May, 2019 - Comments: 0

The trade war between the United States and China is escalating and it is here to stay. Last year, the Trump administration started the trade war with China for basically two reasons. First, China has a massive trade surplus with the U.S. Second, U.S. companies have been the subject of IP theft in China, which has largely gone unchecked, according to the Trump administration. Many disagre... » read more

Q1 2019 Unit Drop Impacts Wafer Demand For 2019

By Joanne Itow - 23 May, 2019 - Comments: 0

The Semico Wafer Demand Model update for Q1 2019 now results in a 5.9% decline in wafer demand for 2019. Along with process technology and productivity, Semico’s Wafer Demand Model is highly dependent on semiconductor unit sales. In the Q1 2019, total semiconductor units dropped by 7.4% compared to Q4 2018 and 3.8% compared to Q1 2018. The drop in units is significant because of the broad spe... » read more

Slow And Cautious Start To 2019 For Memory Manufacturers

By Adrienne Downey - 21 Mar, 2019 - Comments: 0

Both NAND and DRAM prices began dropping in the second half of 2018 after a couple years at record highs. Product oversupply and excess inventories are signaling a bleak outlook for the memory market in the first half of 2019. With these conditions in mind, SK Hynix and Samsung have slowed or put on hold their plans for capacity expansion in 2H18 and 2019. The chart below shows DRAM capacity... » read more

Blog Review: Mar. 20

By Jesse Allen - 20 Mar, 2019 - Comments: 0

Cadence's Paul McLellan argues that rapid improvements in the performance of general-purpose computing led to a lack of innovation in domain-specific architectures, but as scaling slows, they're entering a new golden age. In a video, Mentor's Colin Walls takes a look at the use of floating point in an embedded application and some of the pitfalls associated with it. Synopsys' Taylor Armer... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?