Week In Review: Manufacturing, Test

By Mark LaPedus - 04 Sep, 2020 - Comments: 0

Market research What’s in store for the IC market in 2020 and 2021? Here’s the latest IC forecasts from IC Insights, Semico, Semiconductor Intelligence, WSTS and others. “We at Semiconductor Intelligence find it difficult to expect much of an increase in the world semiconductor market in 2020. However, the strength of the PC market and the relatively optimistic 3Q 2020 guidance of severa... » read more

Impact Of U.S.-China Trade War

By Mark LaPedus - 23 May, 2019 - Comments: 0

The trade war between the United States and China is escalating and it is here to stay. Last year, the Trump administration started the trade war with China for basically two reasons. First, China has a massive trade surplus with the U.S. Second, U.S. companies have been the subject of IP theft in China, which has largely gone unchecked, according to the Trump administration. Many disagre... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 28 Dec, 2018 - Comments: 0

Tariffs The United States and China are in the midst of a trade war. New data shows that tariffs on imported Chinese products now cost the technology industry an additional $1 billion per month, according to the Consumer Technology Association (CTA). Nearly 70% of tariffs paid by the hi-tech industry come from the $200 billion product list enacted Sep. 24. Tariffs on CTA-identified tech pro... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 05 Oct, 2018 - Comments: 1

Chipmakers Fujitsu, once a major manufacturer of ICs, continues to move away from chip production. On Semiconductor has completed the incremental 20% share purchase of Aizu Fujitsu Semiconductor Manufacturing, Fujitsu’s 200mm wafer fab in Aizu-Wakamatsu. On Semi will now hold a 60% majority ownership in the fab joint venture. Consequently, the name of the venture will transition to On Semico... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 15 Jun, 2018 - Comments: 0

Chipmakers and OEMs Tesla Motors has been struggling to get its new electric car, the Model 3, out the door. And it recently implemented a layoff amid ongoing losses. But the struggling car maker could be in the midst of a rebound. “Based on our checks, we believe the perceived quality of Model 3s coming off the lines continue to improve relative to prior checks, and we view this as one of t... » read more

The Week In Review: Sept. 3

By Mark LaPedus - 03 Sep, 2013 - Comments: 0

By Mark LaPedus The cellular chip supplier landscape is littered with corpses. So will 4G lead to the destruction of Qualcomm and Intel? That’s highly unlikely, according to a blog from Strategy Analytics. “With the recent announcement of a multimode LTE chipset from Intel, it seems likely that Qualcomm and Intel will maintain their status as the top two cellular radio chipset suppliers in... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Semiconductor Intelligence

Week In Review: Manufacturing, Test

Impact Of U.S.-China Trade War

Week In Review: Manufacturing, Test

Week In Review: Manufacturing, Test

The Week In Review: Manufacturing

The Week In Review: Sept. 3