Chip Industry Week In Review


Concerns mount on the use of American-manufactured semiconductors in Russian weapons, with Analog Devices, AMD, Intel and TI set to testify next week before the U.S. Senate Permanent Subcommittee on Investigations. Also, U.S. and other government agencies issued a joint advisory and more details about ongoing Russian military cyberattacks, espionage, and sabotage. The U.S. Commerce Departmen... » read more

Security Improving For Low-Cost Hardware


Security has been a priority in software for decades, but only recently has it begun catching up in chips — particularly those in inexpensive devices. The disconnect is that while these devices are low-cost, they often are connected to the same networks as more sophisticated devices and repositories for valuable data. It's not unusual for the entry point in ransomware or distributed denial... » read more

Chip Industry Week in Review


The Biden-Harris Administration announced preliminary terms with HP for $50 million in direct funding under the CHIPs and Science Act to support the expansion and modernization of HP’s existing microfluidics and microelectromechanical systems (“MEMS”) facility in Corvallis, Oregon. CHIPS for America launched the CHIPS Metrology Community, a collaborative initiative designed to advance ... » read more

Chip Industry Week In Review


Chinese firms imported almost $26 billion worth of chipmaking machinery, according to fresh trade data released by China’s General Administration of Customs this week, Bloomberg reports. Meanwhile, the global semiconductor manufacturing industry continued to show signs of improvement in Q2 2024 with significant growth of IC sales, stabilizing capital expenditure, and an increase in install... » read more

Chip Industry Week in Review


Okinawa Institute of Science and Technology proposed a new EUV litho technology using only four reflective mirrors and a new method of illumination optics that it claims will use 1/10 the power and cost half as much as existing EUV technology from ASML. Applied Materials may not receive expected U.S. funding to build a $4 billion research facility in Sunnyvale, CA, due to internal government... » read more

Chip Industry Week In Review


The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

IC Power Optimization Required, But More Difficult To Achieve


Power optimization is playing an increasingly vital role in chip and chip and system designs, but it's also becoming much harder to achieve as transistor density and system complexity continue to grow. This is especially evident with advanced packages, chiplets, and high-performance chips, all of which are becoming more common in complex designs. Inside data centers, racks of servers are str... » read more

Chip Industry Week In Review


The U.S. Department of Commerce issued a notice of intent  to fund new R&D activities to establish and accelerate domestic advanced packaging capacity. CHIPS for America expects to award up to $1.6 billion in funding innovation across five R&D areas, as outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP), with about $150 million per award in each... » read more

Digital Twin And The Implications For Semiconductor Suppliers


Automotive is a prime example of one industry where advanced semiconductors are forcing change across all aspects of vehicle development. Accelerated investment is fueling this industry wide evolution, driven by new business models, environmental regulations, and the evolution toward fully autonomous, software-defined vehicles. The demand for fully and semi-autonomous systems has a particula... » read more

Chip Industry Week In Review


The Design Automation Conference morphed into the Chips to Systems Conference, reflecting an industry shift from monolithic SoCs to assemblies of chiplets in various flavors of advanced packaging. The change drew a slew of students and a resurgent buzz, fueled by discussions about heterogeneous integration, reliability, and ways to leverage AI/ML to speed up design and verification processes. ... » read more

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