Manufacturing Bits: Oct. 20

By Mark LaPedus - 20 Oct, 2015 - Comments: 0

Singapore opens R&D center The Agency for Science, Technology and Research (A*STAR) has officially opened its new R&D center in Singapore. The center, dubbed Fusionopolis Two, is a $450 million facility, according to Singapore’s A*STAR. It will provide the industry with co-location opportunities for R&D. Anchored at Fusionopolis Two are the following A*STAR research institutes: th... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 10 Jul, 2015 - Comments: 0

An alliance led by IBM Research has produced the semiconductor industry’s first 7nm test chips with functioning transistors. The breakthrough, accomplished in partnership with GlobalFoundries and Samsung at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering, could result in the ability to place more than 20 billion tiny switches, or transistors, on a chip. There i... » read more

Analysis: Applied-TEL Scrap Merger

By Mark LaPedus - 27 Apr, 2015 - Comments: 0

After several delays due to a myriad of complex regulatory issues, Applied Materials’ proposed deal to buy Tokyo Electron Ltd. (TEL) has been scrapped. It appears that the U.S. Department of Justice (DoJ) stepped in and blocked the deal. Now that the deal has been terminated, Applied Materials and TEL are separately re-grouping, and are back to where they originally started as fierce compe... » read more

Plunify: FPGA Design Closure

By Ed Sperling - 09 Feb, 2015 - Comments: 0

The number of EDA startups has plummeted around the globe, and nowhere is this more evident than in Singapore. In fact, there is exactly one EDA startup in that country—[getentity id="22672" e_name="Plunify"]—and even that isn't so new. Plunify started life in 2009 as a cloud-based startup, whose mission was to provide public cloud compute services to companies developing FPGAs. While th... » read more

Manufacturing Bits: Nov. 4

By Mark LaPedus - 04 Nov, 2014 - Comments: 0

World’s fastest IC amplifier Northrop Grumman has set a record for the world’s fastest integrated circuit amplifier. The record has been recognized by officials from Guinness World Records. The amplifier uses 10 transistor stages to reach an operating speed of one terahertz, or one trillion cycles per second. This surpassed the company's own record of 850 billion cycles per second set i... » read more

Manufacturing Bits: Feb. 18

By Mark LaPedus - 18 Feb, 2014 - Comments: 1

Polite cupcake helping robots Cornell and Carnegie Mellon have made a new discovery about robots. If they sound less snippy when they communicate, listeners will respond better. In fact, developers of robots should develop systems that use less confrontational language. In the study, entitled “How a Robot Should Give Advice,” researchers discovered that robots and humans are more lik... » read more

Upbeat Prediction

By SEMI - 18 Apr, 2013 - Comments: 0

By Clark Tseng The semiconductor industry started out quite strong in 2012 but declined rapidly in the second half of the year, resulting in a slight year-over-year decline of 2.7% in worldwide semiconductor sales. On the other hand, worldwide capital equipment market recorded a decline of 15% from $43.5 billion in 2011 to $36.9 billion in 2012 according to the SEMI WWSEMS report. While indust... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer