Week In Review: Manufacturing, Test

By Karen Heyman - 02 Sep, 2022 - Comments: 0

New fab construction At an event in Arizona, U.S. Commerce Secretary Gina Raimondo urged states to compete for funding made available for producing semiconductors by the U.S. federal government. Indeed, several companies are already doing just that. The latest developments include: Micron plans to invest approximately $15 billion through 2030 for a new memory fab near its existing headquart... » read more

Week In Review: Manufacturing, Test

By Karen Heyman - 29 Jul, 2022 - Comments: 1

The U.S. Congress approved the CHIPS Act, a mammoth bipartisan achievement the New York Times called “the most significant government intervention in industrial policy in decades.” As passed, the full package — now called the Chips and Science Act — contains $52 billion in direct assistance for the semiconductor industry, along with $24 billion in tax incentives. In addition, the bill c... » read more

Startup Funding: June 2022

By Jesse Allen - 06 Jul, 2022 - Comments: 0

Big money went to manufacturing in June, with a massive round for a Chinese analog foundry’s expansion to 55 – 40nm nodes. A fab management software startup also drew sizeable investment, as did a supplier of semiconductor-grade silicon components. Investors didn’t forget chip design, with three EDA companies receiving new funding, one of which drew over $100 million. Plus, numerous te... » read more

Week In Review: Manufacturing, Test

By Linda Christensen - 01 Apr, 2022 - Comments: 0

The U.S. Senate approved the 2022 America COMPETES act, which has big ramifications for the chip industry. The bill now heads to the House for further reconciliation. If approved, it would provide more than $50 billion in U.S. subsidies for semiconductor chip manufacturing. The SIAC (Semiconductor In America Coalition) urged Congress to act promptly to achieve a bipartisan compromise soon and o... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: SK Group

Week In Review: Manufacturing, Test

Week In Review: Manufacturing, Test

Startup Funding: June 2022

Week In Review: Manufacturing, Test

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